Assignee
58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION
CN·1 granted patent·5 pending applications·0 citations·filing 2021–2021
Top patents by PatentIndex Score
6 records- 0143US11971446B2Interface system for interconnected die and MPU and communication method thereof58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Granted Apr 30, 2024·0 cites·8 claims
- 0230US2022276671A1The Clock Domain System of Interconnected Dies and Its Management Methods58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0330US2022276973A1Data transmission event used for interconnected dies58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0427US2022276306A1Communication method and its system between interconnected die and dsp/fpga58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0527US2022276982A1Interconnected Dies, Interconnected Microcomponents, Interconnected Microsystems and Their Communication Methods58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
- 0626US2022276677A1An Inter-Die High-Speed Expansion System And An Expansion Method Thereof58TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECH GROUP CORPORATION·Filed 2021·Application pending·0 cites
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