Assignee
ABBOTT DONALD C
US·7 granted patents·1 pending application·33 citations·filing 2010–2012
Top patents by PatentIndex Score
8 records- 0194US8587099B1Leadframe having selective planishingABBOTT DONALD C·Filed 2012·Granted Nov 19, 2013·13 cites·7 claims
- 0288US8158460B2Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compoundsABBOTT DONALD C·Filed 2011·Granted Apr 17, 2012·8 cites·10 claims
- 0384US8242614B2Thermally improved semiconductor QFN/SON packageABBOTT DONALD C·Filed 2010·Granted Aug 14, 2012·6 cites·9 claims
- 0481US8138026B2Low cost lead-free preplated leadframe having improved adhesion and solderabilityABBOTT DONALD C·Filed 2010·Granted Mar 20, 2012·4 cites·2 claims
- 0568US8227298B2Semiconductor package having buss-less substrateABBOTT DONALD C·Filed 2011·Granted Jul 24, 2012·2 cites·16 claims
- 0648US8574931B2Singulation and strip testing of no-lead integrated circuit packages without tape frameABBOTT DONALD C·Filed 2011·Granted Nov 5, 2013·0 cites·13 claims
- 0748US8471155B2Metal plugged substrates with no adhesive between metal and polyimideABBOTT DONALD C·Filed 2011·Granted Jun 25, 2013·0 cites·7 claims
- 0839US2013082407A1Integrated Circuit Package And MethodABBOTT DONALD C·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →