Assignee
ABE TOMOYUKI
JP·3 granted patents·57 citations·filing 2006–2010
Top patents by PatentIndex Score
3 records- 0195US8158503B2Multilayer interconnection substrate and method of manufacturing the sameABE TOMOYUKI·Filed 2006·Granted Apr 17, 2012·53 cites·7 claims
- 0270US8178791B2Wiring substrate including conductive core substrate, and manufacturing method thereofABE TOMOYUKI·Filed 2008·Granted May 15, 2012·4 cites·20 claims
- 0347US8642894B2Circuit board, method of manufacturing the same, and resistance elementABE TOMOYUKI·Filed 2010·Granted Feb 4, 2014·0 cites·9 claims
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