Assignee
ABSOLICS INC
US14 patents
Top patents by PatentIndex Score
US11437308B2Sep 6, 2022
Packaging glass substrate for semiconductor, a packaging substrate for semiconductor, and a semiconductor apparatus
ABSOLICS INC3 citations71
US12469736B2Nov 11, 2025
Substrate carrier and substrate assembly comprising the same
ABSOLICS INC0 citations61
US12456653B2Oct 28, 2025
Packaging substrate and semiconductor device comprising the same
ABSOLICS INC1 citations61
US12198994B2Jan 14, 2025
Packaging substrate and method for manufacturing same
ABSOLICS INC1 citations61
US12027454B1Jul 2, 2024
Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
ABSOLICS INC0 citations60
US11728259B2Aug 15, 2023
Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
ABSOLICS INC0 citations60
US11469167B2Oct 11, 2022
Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
ABSOLICS INC0 citations60
US12456672B2Oct 28, 2025
Packaging substrate having element group in cavity unit and semiconductor device comprising the same
ABSOLICS INC0 citations59
US11652039B2May 16, 2023
Packaging substrate with core layer and cavity structure and semiconductor device comprising the same
ABSOLICS INC0 citations59
US12506040B2Dec 23, 2025
Packaging substrate, semiconductor package, packaging substrate preparation method, and semiconductor package preparation method
ABSOLICS INC0 citations52
US12288742B2Apr 29, 2025
Packaging substrate and semiconductor apparatus comprising same
ABSOLICS INC0 citations49
US12165979B2Dec 10, 2024
Packaging substrate and semiconductor apparatus comprising same
ABSOLICS INC0 citations49
US11981501B2May 14, 2024
Loading cassette for substrate including glass and substrate loading method to which same is applied
ABSOLICS INC0 citations49
US11967542B2Apr 23, 2024
Packaging substrate, and semiconductor device comprising same
ABSOLICS INC0 citations49