Assignee
ADVANCE SEMICONDUCTOR ENGINEER
TW·2 granted patents·3 pending applications·200 citations·filing 2004–2006
Top patents by PatentIndex Score
5 records- 0196US6921968B2Stacked flip chip packageADVANCE SEMICONDUCTOR ENGINEER·Filed 2004·Granted Jul 26, 2005·177 cites·7 claims
- 0285US7351612B2Method for fabricating quad flat non-leaded packageADVANCE SEMICONDUCTOR ENGINEER·Filed 2005·Granted Apr 1, 2008·23 cites·8 claims
- 0340US2005275098A1Lead-free conductive jointing bumpADVANCE SEMICONDUCTOR ENGINEER·Filed 2005·Application pending·0 cites
- 0440US2006211173A1Package of image sensor device and formation thereofADVANCE SEMICONDUCTOR ENGINEER·Filed 2006·Application pending·0 cites
- 0538US2005263883A1Asymmetric bump structureADVANCE SEMICONDUCTOR ENGINEER·Filed 2005·Application pending·0 cites
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