Assignee

ADVANCED SEMICONDUCTOR ENIGNEE

TW·1 granted patent·20 citations·filing 2002–2002

Technology mixB23K1 H10W1 Y10T1

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0173US6863208B2Wire bonding process and wire bond structureADVANCED SEMICONDUCTOR ENIGNEE·Filed 2002·Granted Mar 8, 2005·20 cites·3 claims

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