Assignee
AEGIS INC
US·5 granted patents·223 citations·filing 1984–1992
Top patents by PatentIndex Score
5 records- 0193US4633573AMicrocircuit package and sealing methodAEGIS INC·Filed 1984·Granted Jan 6, 1987·108 cites·20 claims
- 0270US4649229AAll metal flat package for microcircuitryAEGIS INC·Filed 1985·Granted Mar 10, 1987·29 cites·7 claims
- 0360US5111277ASurface mount device with high thermal conductivityAEGIS INC·Filed 1991·Granted May 5, 1992·31 cites·29 claims
- 0459US5188985ASurface mount device with high thermal conductivityAEGIS INC·Filed 1992·Granted Feb 23, 1993·30 cites·12 claims
- 0559US4768077ALead frame having non-conductive tie-bar for use in integrated circuit packagesAEGIS INC·Filed 1986·Granted Aug 30, 1988·25 cites·30 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →