Assignee
AGA HIROJI
JP·2 granted patents·2 pending applications·1 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0159US8728912B2Method for manufacturing SOI waferAGA HIROJI·Filed 2011·Granted May 20, 2014·1 cites·2 claims
- 0238US8987109B2Method for manufacturing bonded wafer and bonded SOI waferAGA HIROJI·Filed 2012·Granted Mar 24, 2015·0 cites·17 claims
- 0334US2013102126A1Method for manufacturing bonded waferAGA HIROJI·Filed 2011·Application pending·0 cites
- 0432US2011281420A1Method for manufacturing soi waferAGA HIROJI·Filed 2010·Application pending·0 cites
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