Assignee
AHMAD NAZIR
US·2 granted patents·2 pending applications·2 citations·filing 2008–2011
Top patents by PatentIndex Score
4 records- 0165US8119450B2Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spotsAHMAD NAZIR·Filed 2009·Granted Feb 21, 2012·2 cites·18 claims
- 0250US9312150B2Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip packageAHMAD NAZIR·Filed 2011·Granted Apr 12, 2016·0 cites·15 claims
- 0349US2012217635A9Packaging Structure and MethodAHMAD NAZIR·Filed 2011·Application pending·0 cites
- 0435US2008277747A1MEMS device support structure for sensor packagingAHMAD NAZIR·Filed 2008·Application pending·0 cites
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