Assignee

AKAMATSU TOSHIYA

JP·2 granted patents·2 citations·filing 2011–2011

Technology mixH05K2 H10W2 B23K1 C22C1 H10D1 Y10T1

Top patents by PatentIndex Score

2 records

0157US8692386B2Semiconductor device, method of manufacturing semiconductor device, and electronic deviceAKAMATSU TOSHIYA·Filed 2011·Granted Apr 8, 2014·1 cites·20 claims
0253US8673762B2Solder, soldering method, and semiconductor deviceAKAMATSU TOSHIYA·Filed 2011·Granted Mar 18, 2014·1 cites·4 claims

Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →