Assignee
AKATSUKA YASUMASA
0 granted patents·3 pending applications·0 citations·filing 2003–2006
Top patents by PatentIndex Score
3 records- 0146US2008032154A1Epoxy Resin, Epoxy Resin Composition and Cured Product ThereofAKATSUKA YASUMASA·Filed 2005·Application pending·0 cites
- 0244US2009056982A1Process for producing a double-sided flexible printed board and double-sided flexible printed boardAKATSUKA YASUMASA·Filed 2006·Application pending·0 cites
- 0342US2006058469A1Flame retardant epoxy resin composition and cured object obtained therefromAKATSUKA YASUMASA·Filed 2003·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →