Assignee
ALCHIMER
FR7 patents
Top patents by PatentIndex Score
US7579274B2Aug 25, 2009
Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices
ALCHIMER9 citations82
US7968653B2Jun 28, 2011
Modification process for polymer surfaces, notably for hydroxylation of polymer surfaces and products so obtained
ALCHIMER0 citations50
US7956099B2Jun 7, 2011
Modification process for polymer surfaces, notably for hydroxylation of polymer surfaces and products so obtained
ALCHIMER0 citations50
US10472726B2Nov 12, 2019
Electrolyte and process for electroplating copper onto a barrier layer
ALCHIMER0 citations45
US10460945B2Oct 29, 2019
Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure
ALCHIMER0 citations38
US9564333B2Feb 7, 2017
Method for forming a metal silicide using a solution containing gold ions and fluorine ions
ALCHIMER0 citations38
US10011914B2Jul 3, 2018
Copper electrodeposition bath containing an electrochemically inert cation
ALCHIMER0 citations28