Assignee
AMKOR ELECTRONICS INC
US23 patents
Top patents by PatentIndex Score
US5355283AOct 11, 1994
Ball grid array with via interconnection
AMKOR ELECTRONICS INC568 citations99
US5723899AMar 3, 1998
Semiconductor lead frame having connection bar and guide rings
AMKOR ELECTRONICS INC245 citations98
US5701034ADec 23, 1997
Packaged semiconductor die including heat sink with locking feature
AMKOR ELECTRONICS INC325 citations98
US5485037AJan 16, 1996
Semiconductor device having a thermal dissipator and electromagnetic shielding
AMKOR ELECTRONICS INC174 citations98
US5478007ADec 26, 1995
Method for interconnection of integrated circuit chip and substrate
AMKOR ELECTRONICS INC154 citations98
US5650593AJul 22, 1997
Thermally enhanced chip carrier package
AMKOR ELECTRONICS INC126 citations97
US5854741ADec 29, 1998
Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same
AMKOR ELECTRONICS INC66 citations96
US5583378ADec 10, 1996
Ball grid array integrated circuit package with thermal conductor
AMKOR ELECTRONICS INC290 citations96
US5482898AJan 9, 1996
Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding
AMKOR ELECTRONICS INC84 citations96
US5483100AJan 9, 1996
Integrated circuit package with via interconnections formed in a substrate
AMKOR ELECTRONICS INC45 citations96
US5455462AOct 3, 1995
Plastic molded package with heat sink for integrated circuit devices
AMKOR ELECTRONICS INC48 citations96
US5328870AJul 12, 1994
Method for forming plastic molded package with heat sink for integrated circuit devices
AMKOR ELECTRONICS INC51 citations96
US5829988ANov 3, 1998
Socket assembly for integrated circuit chip carrier package
AMKOR ELECTRONICS INC111 citations94
US5722161AMar 3, 1998
Method of making a packaged semiconductor die including heat sink with locking feature
AMKOR ELECTRONICS INC43 citations92
US5482736AJan 9, 1996
Method for applying flux to ball grid array package
AMKOR ELECTRONICS INC54 citations92
US5378869AJan 3, 1995
Method for forming an integrated circuit package with via interconnection
AMKOR ELECTRONICS INC41 citations92
US5827999AOct 27, 1998
Homogeneous chip carrier package
AMKOR ELECTRONICS INC48 citations91
US5672909ASep 30, 1997
Interdigitated wirebond programmable fixed voltage planes
AMKOR ELECTRONICS INC30 citations91
US5596485AJan 21, 1997
Plastic packaged integrated circuit with heat spreader
AMKOR ELECTRONICS INC30 citations91
US5381042AJan 10, 1995
Packaged integrated circuit including heat slug having an exposed surface
AMKOR ELECTRONICS INC257 citations91
US5183724AFeb 2, 1993
Method of producing a strip of lead frames for integrated circuit dies in a continuous system
AMKOR ELECTRONICS INC13 citations71
US5305043AApr 19, 1994
Method of and apparatus for producing a strip of lead frames for integrated circuit dies in a continuous system
AMKOR ELECTRONICS INC5 citations60
US5269210ADec 14, 1993
Slitter machine for use in manufacturing semiconductor devices
AMKOR ELECTRONICS INC4 citations60