Assignee

AMKOR TECH SINGAPORE HOLDING PTE LTD

SG·269 granted patents·152 pending applications·156 citations·filing 2016–2025

Technology mixH10W418 H01L397 H10P167 H01Q19 H10F17 H05K16

Top patents by PatentIndex Score

421 records

0198US11869879B2Semiconductor package using a coreless signal distribution structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Jan 9, 2024·3 cites·20 claims
0298US11424155B2Semiconductor device package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
0397US11901335B2Semiconductor package with routing patch and conductive interconnection structures laterally displaced from routing patchAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Feb 13, 2024·2 cites·18 claims
0497US11764078B2Stiffener package and method of fabricating stiffener packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
0597US11557524B2Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jan 17, 2023·4 cites·20 claims
0697US11488934B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 1, 2022·5 cites·20 claims
0797US11476233B2Semiconductor package using a coreless signal distribution structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Oct 18, 2022·3 cites·20 claims
0896US11289451B2Semiconductor package with high routing density patchAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Mar 29, 2022·3 cites·22 claims
0995US11855000B2Semiconductor device having EMI shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
1095US11107701B2Stiffener package and method of fabricating stiffener packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 31, 2021·3 cites·20 claims
1194US11869875B2Electronic device having a substrate-to-substrate interconnection structure and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jan 9, 2024·2 cites·20 claims
1294US11862539B2Method of forming a packaged semiconductor device having enhanced wettable flank and structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Jan 2, 2024·2 cites·20 claims
1394US11652038B2Semiconductor package with front side and back side redistribution structures and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted May 16, 2023·2 cites·20 claims
1494US11562964B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 24, 2023·5 cites·20 claims
1594US10872879B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2018·Granted Dec 22, 2020·9 cites·20 claims
1694US2026076222A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
1794US2026076275A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
1894US2026047438A1Semiconductor device having emi shielding structure and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
1993US11961797B2Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 16, 2024·2 cites·19 claims
2093US11862892B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jan 2, 2024·2 cites·20 claims
2193US11611170B2Semiconductor devices having exposed clip top sides and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Mar 21, 2023·3 cites·20 claims
2292US12046798B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 23, 2024·2 cites·16 claims
2392US11881458B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jan 23, 2024·2 cites·21 claims
2492US11694946B2Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 4, 2023·2 cites·27 claims
2592US11482496B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Oct 25, 2022·3 cites·22 claims
2692US2026076274A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
2792US2026005127A1Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
2892US2025372490A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
2990US12033910B2Wafer-level stack chip package and method of manufacturing the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jul 9, 2024·2 cites·20 claims
3090US11887916B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 30, 2024·2 cites·14 claims
3190US11508635B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 22, 2022·2 cites·19 claims
3290US11282763B2Semiconductor device having a lid with through-holesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Mar 22, 2022·7 cites·19 claims
3390US11031256B2Semiconductor device with tiered pillar and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 8, 2021·2 cites·19 claims
3490US11011497B2Electronic device having a substrate-to-substrate interconnection structure and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted May 18, 2021·4 cites·17 claims
3590US2025096107A1Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
3689US12230661B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Feb 18, 2025·0 cites·20 claims
3789US11996369B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted May 28, 2024·1 cites·20 claims
3889US11728280B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Aug 15, 2023·2 cites·20 claims
3989US11626337B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Apr 11, 2023·2 cites·20 claims
4089US2026076272A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
4189US2025349817A1Semiconductor device using emc wafer support system and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
4288US11574890B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Feb 7, 2023·2 cites·16 claims
4388US11482500B2Method of forming an electronic device structure having an electronic component with an on-edge orientation and related structuresAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Oct 25, 2022·2 cites·20 claims
4488US2026076273A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
4588US2026024908A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
4688US2026076194A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
4787US12438110B2Fingerprint sensor and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Oct 7, 2025·0 cites·19 claims
4887US12438124B2Semiconductor package with routing patch and method of fabricating the semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Oct 7, 2025·0 cites·18 claims
4987US12327812B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Jun 10, 2025·0 cites·22 claims
5087US11355470B2Semiconductor device and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 7, 2022·2 cites·16 claims

Showing the top 50 of 421 patent records by PatentIndex Score.

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