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AMKOR TECHNOLOGY INC
US851 patents
Top patents by PatentIndex Score
US8710649B1Apr 29, 2014
Wafer level package and fabrication method
AMKOR TECHNOLOGY INC47 citations99
US7932595B1Apr 26, 2011
Electronic component package comprising fan-out traces
AMKOR TECHNOLOGY INC66 citations99
US7932170B1Apr 26, 2011
Flip chip bump structure and fabrication method
AMKOR TECHNOLOGY INC197 citations99
US7777351B1Aug 17, 2010
Thin stacked interposer package
AMKOR TECHNOLOGY INC413 citations99
US7714431B1May 11, 2010
Electronic component package comprising fan-out and fan-in traces
AMKOR TECHNOLOGY INC98 citations99
US7671457B1Mar 2, 2010
Semiconductor package including top-surface terminals for mounting another semiconductor package
AMKOR TECHNOLOGY INC233 citations99
US7548430B1Jun 16, 2009
Buildup dielectric and metallization process and semiconductor package
AMKOR TECHNOLOGY INC202 citations99
US7342303B1Mar 11, 2008
Semiconductor device having RF shielding and method therefor
AMKOR TECHNOLOGY INC144 citations99
US7211471B1May 1, 2007
Exposed lead QFP package fabricated through the use of a partial saw process
AMKOR TECHNOLOGY INC114 citations99
US7192807B1Mar 20, 2007
Wafer level package and fabrication method
AMKOR TECHNOLOGY INC139 citations99
US7185426B1Mar 6, 2007
Method of manufacturing a semiconductor package
AMKOR TECHNOLOGY INC395 citations99
US6987314B1Jan 17, 2006
Stackable semiconductor package with solder on pads on which second semiconductor package is stacked
AMKOR TECHNOLOGY INC106 citations99
US6930256B1Aug 16, 2005
Integrated circuit substrate having laser-embedded conductive patterns and method therefor
AMKOR TECHNOLOGY INC235 citations99
US6927478B2Aug 9, 2005
Reduced size semiconductor package with stacked dies
AMKOR TECHNOLOGY INC193 citations99
US6905914B1Jun 14, 2005
Wafer level package and fabrication method
AMKOR TECHNOLOGY INC117 citations99
US6858919B2Feb 22, 2005
Semiconductor package
AMKOR TECHNOLOGY INC130 citations99
US6818973B1Nov 16, 2004
Exposed lead QFP package fabricated through the use of a partial saw process
AMKOR TECHNOLOGY INC203 citations99
US6791076B2Sep 14, 2004
Image sensor package
AMKOR TECHNOLOGY INC190 citations99
US6734419B1May 11, 2004
Method for forming an image sensor package with vision die in lens housing
AMKOR TECHNOLOGY INC209 citations99
US6730544B1May 4, 2004
Stackable semiconductor package and method for manufacturing same
AMKOR TECHNOLOGY INC217 citations99
US6686588B1Feb 3, 2004
Optical module with lens integral holder
AMKOR TECHNOLOGY INC267 citations99
US6683377B1Jan 27, 2004
Multi-stacked memory package
AMKOR TECHNOLOGY INC214 citations99
US6672773B1Jan 6, 2004
Optical fiber having tapered end and optical connector with reciprocal opening
AMKOR TECHNOLOGY INC158 citations99
US6624005B1Sep 23, 2003
Semiconductor memory cards and method of making same
AMKOR TECHNOLOGY INC304 citations99
US6577013B1Jun 10, 2003
Chip size semiconductor packages with stacked dies
AMKOR TECHNOLOGY INC559 citations99
US6571466B1Jun 3, 2003
Flip chip image sensor package fabrication method
AMKOR TECHNOLOGY INC282 citations99
US6555917B1Apr 29, 2003
Semiconductor package having stacked semiconductor chips and method of making the same
AMKOR TECHNOLOGY INC353 citations99
US6545345B1Apr 8, 2003
Mounting for a package containing a chip
AMKOR TECHNOLOGY INC199 citations99
US6531784B1Mar 11, 2003
Semiconductor package with spacer strips
AMKOR TECHNOLOGY INC299 citations99
US6530515B1Mar 11, 2003
Micromachine stacked flip chip package fabrication method
AMKOR TECHNOLOGY INC151 citations99
US6492699B1Dec 10, 2002
Image sensor package having sealed cavity over active area
AMKOR TECHNOLOGY INC148 citations99
US6483101B1Nov 19, 2002
Molded image sensor package having lens holder
AMKOR TECHNOLOGY INC235 citations99
US6483030B1Nov 19, 2002
Snap lid image sensor package
AMKOR TECHNOLOGY INC105 citations99
US6433277B1Aug 13, 2002
Plastic integrated circuit package and method and leadframe for making the package
AMKOR TECHNOLOGY INC83 citations99
US6424315B1Jul 23, 2002
Semiconductor chip having a radio-frequency identification transceiver
AMKOR TECHNOLOGY INC249 citations99
US6342406B1Jan 29, 2002
Flip chip on glass image sensor package fabrication method
AMKOR TECHNOLOGY INC174 citations99
US6291884B1Sep 18, 2001
Chip-size semiconductor packages
AMKOR TECHNOLOGY INC182 citations99
US6274927B1Aug 14, 2001
Plastic package for an optical integrated circuit device and method of making
AMKOR TECHNOLOGY INC228 citations99
US6268654B1Jul 31, 2001
Integrated circuit package having adhesive bead supporting planar lid above planar substrate
AMKOR TECHNOLOGY INC198 citations99
US6266197B1Jul 24, 2001
Molded window array for image sensor packages
AMKOR TECHNOLOGY INC337 citations99
US6228676B1May 8, 2001
Near chip size integrated circuit package
AMKOR TECHNOLOGY INC151 citations99
US6214644B1Apr 10, 2001
Flip-chip micromachine package fabrication method
AMKOR TECHNOLOGY INC158 citations99
US6150193ANov 21, 2000
RF shielded device
AMKOR TECHNOLOGY INC283 citations99
US6143981ANov 7, 2000
Plastic integrated circuit package and method and leadframe for making the package
AMKOR TECHNOLOGY INC476 citations99
US6143588ANov 7, 2000
Method of making an integrated circuit package employing a transparent encapsulant
AMKOR TECHNOLOGY INC291 citations99
US6124637ASep 26, 2000
Carrier strip and molded flex circuit ball grid array and method of making
AMKOR TECHNOLOGY INC107 citations99
US6117705ASep 12, 2000
Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate
AMKOR TECHNOLOGY INC202 citations99
US5985695ANov 16, 1999
Method of making a molded flex circuit ball grid array
AMKOR TECHNOLOGY INC134 citations99
US5981314ANov 9, 1999
Near chip size integrated circuit package
AMKOR TECHNOLOGY INC280 citations99
US5949655ASep 7, 1999
Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
AMKOR TECHNOLOGY INC157 citations99
Showing the top 50 of 851 patents by PatentIndex Score.