Assignee
ANDERSON FRANK EDWARD
US·6 granted patents·15 citations·filing 2006–2011
Top patents by PatentIndex Score
6 records- 0182US8087756B2Heater chips with silicon die bonded on silicon substrateANDERSON FRANK EDWARD·Filed 2011·Granted Jan 3, 2012·5 cites·3 claims
- 0276US8313167B2Tiled manifold for a page wide printheadANDERSON FRANK EDWARD·Filed 2009·Granted Nov 20, 2012·4 cites·9 claims
- 0376US8210660B2High volume ink delivery manifold for a page wide printheadANDERSON FRANK EDWARD·Filed 2009·Granted Jul 3, 2012·4 cites·20 claims
- 0466US8777376B2Skewed nozzle arrays on ejection chips for micro-fluid applicationsANDERSON FRANK EDWARD·Filed 2010·Granted Jul 15, 2014·1 cites·10 claims
- 0563US8622524B2Laminate constructs for micro-fluid ejection devicesANDERSON FRANK EDWARD·Filed 2010·Granted Jan 7, 2014·1 cites·16 claims
- 0647US8061811B2Micro-fluid ejection heads with chips in pocketsANDERSON FRANK EDWARD·Filed 2006·Granted Nov 22, 2011·0 cites·11 claims
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