Assignee
ANTESBERGER TIMOTHY
US·2 granted patents·10 citations·filing 2009–2009
Top patents by PatentIndex Score
2 records- 0172US8405229B2Electronic package including high density interposer and circuitized substrate assembly utilizing sameANTESBERGER TIMOTHY·Filed 2009·Granted Mar 26, 2013·6 cites·15 claims
- 0267US8245392B2Method of making high density interposer and electronic package utilizing sameANTESBERGER TIMOTHY·Filed 2009·Granted Aug 21, 2012·4 cites·20 claims
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