Assignee

AOKI SHOJI

JP·1 granted patent·5 citations·filing 2006–2006

Technology mixC22C1 C23C1 H01J1 H01L1 H10P1 H10W1

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0168US9028658B2Mn-containing copper alloy sputtering target generating few particlesAOKI SHOJI·Filed 2006·Granted May 12, 2015·5 cites·1 claims

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