Assignee
ARAI HIDETA
JP4 patents
Top patents by PatentIndex Score
US8524378B2Sep 3, 2013
Copper foil for printed circuit
ARAI HIDETA8 citations82
US9060431B2Jun 16, 2015
Liquid crystal polymer copper-clad laminate and copper foil used for said laminate
ARAI HIDETA7 citations81
US9580829B2Feb 28, 2017
Copper foil for printed circuit
ARAI HIDETA0 citations50
US9049795B2Jun 2, 2015
Rolled copper or copper-alloy foil provided with roughened surface
ARAI HIDETA0 citations50