Assignee
ARIECA INC
US·3 granted patents·6 pending applications·15 citations·filing 2020–2024
Top patents by PatentIndex Score
9 records- 0194US10777483B1Method, apparatus, and assembly for thermally connecting layersARIECA INC·Filed 2020·Granted Sep 15, 2020·14 cites·15 claims
- 0278US11335622B2Method, apparatus, and assembly for thermally connecting layersARIECA INC·Filed 2020·Granted May 17, 2022·1 cites·16 claims
- 0362US2025197596A1Methods of manufacture for thermal interface materials and apparatuses used thereofARIECA INC·Filed 2024·Application pending·0 cites
- 0457US12027442B1Thermal interface material, an integrated circuit formed therewith, and a method of application thereofARIECA INC·Filed 2023·Granted Jul 2, 2024·0 cites·30 claims
- 0553US2025069987A1A thermal interface material, an integrated circuit assembly, and a method for thermally connecting layersARIECA INC·Filed 2023·Application pending·0 cites
- 0651US2025037294A1Methods and systems for generating a bond line parameter of a circuit assembly, and methods of manufacture of a circuit assemblyARIECA INC·Filed 2024·Application pending·0 cites
- 0748US2024243033A1Method of manufacture of a thermal interface material, a thermal interface material formed therefrom, and an integrated circuit formed therefromARIECA INC·Filed 2023·Application pending·0 cites
- 0847US2024203754A1Method of deposition of a thermal interface material onto a circuit assembly and an integrated circuit formed therefromARIECA INC·Filed 2023·Application pending·0 cites
- 0946US2024213115A1A method, apparatus, and assembly for thermally connecting layers with thermal interface materials comprising rigid particlesARIECA INC·Filed 2022·Application pending·0 cites
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