Assignee
ARISA SHIGEHARU
JP·1 granted patent·1 pending application·2 citations·filing 2009–2009
Top patents by PatentIndex Score
2 records- 0159US8152597B2Wafer grinding method and wafer grinding machineARISA SHIGEHARU·Filed 2009·Granted Apr 10, 2012·2 cites·2 claims
- 0240US2009247050A1Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in sameARISA SHIGEHARU·Filed 2009·Application pending·0 cites
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