Assignee
ARITA KAZUO
JP·2 granted patents·2 citations·filing 2006–2011
Top patents by PatentIndex Score
2 records- 0164US8669333B2Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up filmARITA KAZUO·Filed 2011·Granted Mar 11, 2014·2 cites·12 claims
- 0247US8729192B2Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating materialARITA KAZUO·Filed 2006·Granted May 20, 2014·0 cites·15 claims
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