Assignee
ASAHI TOSHIYUKI
JP·2 granted patents·2 pending applications·4 citations·filing 2004–2010
Top patents by PatentIndex Score
4 records- 0168US8465666B2Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive compositionASAHI TOSHIYUKI·Filed 2010·Granted Jun 18, 2013·3 cites·26 claims
- 0257US8064213B2Module with a built-in component, and electronic device with the sameASAHI TOSHIYUKI·Filed 2005·Granted Nov 22, 2011·1 cites·23 claims
- 0346US2010230138A1Wiring boardASAHI TOSHIYUKI·Filed 2008·Application pending·0 cites
- 0438US2007069393A1Wiring board embedded with spherical semiconductor elementASAHI TOSHIYUKI·Filed 2004·Application pending·0 cites
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