Assignee
ASAI MASAYUKI
JP3 patents
Top patents by PatentIndex Score
US8168549B2May 1, 2012
Method of manufacturing semiconductor device and substrate processing apparatus
ASAI MASAYUKI4 citations60
US9175395B2Nov 3, 2015
Substrate processing apparatus and semiconductor device manufacturing method
ASAI MASAYUKI1 citations48
US9545736B2Jan 17, 2017
Mold and die metallic material, air-permeable member for mold and die use, and method for manufacturing the same
ASAI MASAYUKI0 citations36