Assignee
ASAT LTD
HK68 patents
Top patents by PatentIndex Score
US7372151B1May 13, 2008
Ball grid array package and process for manufacturing same
ASAT LTD461 citations99
US7009286B1Mar 7, 2006
Thin leadless plastic chip carrier
ASAT LTD117 citations99
US6995460B1Feb 7, 2006
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD119 citations99
US6989294B1Jan 24, 2006
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD101 citations99
US6946324B1Sep 20, 2005
Process for fabricating a leadless plastic chip carrier
ASAT LTD182 citations99
US6933176B1Aug 23, 2005
Ball grid array package and process for manufacturing same
ASAT LTD121 citations99
US6635957B2Oct 21, 2003
Leadless plastic chip carrier with etch back pad singulation and die attach pad array
ASAT LTD199 citations99
US6545347B2Apr 8, 2003
Enhanced leadless chip carrier
ASAT LTD148 citations99
US5843808ADec 1, 1998
Structure and method for automated assembly of a tab grid array package
ASAT LTD218 citations99
US7482690B1Jan 27, 2009
Electronic components such as thin array plastic packages and process for fabricating same
ASAT LTD86 citations98
US7371610B1May 13, 2008
Process for fabricating an integrated circuit package with reduced mold warping
ASAT LTD79 citations98
US6987032B1Jan 17, 2006
Ball grid array package and process for manufacturing same
ASAT LTD126 citations98
US6964918B1Nov 15, 2005
Electronic components such as thin array plastic packages and process for fabricating same
ASAT LTD84 citations98
US6933594B2Aug 23, 2005
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD140 citations98
US6818978B1Nov 16, 2004
Ball grid array package with shielding
ASAT LTD112 citations98
US6724071B2Apr 20, 2004
Molded plastic package with heat sink and enhanced electrical performance
ASAT LTD180 citations98
US6498099B1Dec 24, 2002
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD519 citations98
US6294100B1Sep 25, 2001
Exposed die leadless plastic chip carrier
ASAT LTD349 citations98
US6285075B1Sep 4, 2001
Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly
ASAT LTD280 citations98
US6242281B1Jun 5, 2001
Saw-singulated leadless plastic chip carrier
ASAT LTD413 citations98
US6229200B1May 8, 2001
Saw-singulated leadless plastic chip carrier
ASAT LTD556 citations98
US5596231AJan 21, 1997
High power dissipation plastic encapsulated package for integrated circuit die
ASAT LTD203 citations98
US7358119B2Apr 15, 2008
Thin array plastic package without die attach pad and process for fabricating the same
ASAT LTD78 citations97
US7348663B1Mar 25, 2008
Integrated circuit package and method for fabricating same
ASAT LTD135 citations97
US7315080B1Jan 1, 2008
Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader
ASAT LTD76 citations97
US7224048B1May 29, 2007
Flip chip ball grid array package
ASAT LTD65 citations97
US6979594B1Dec 27, 2005
Process for manufacturing ball grid array package
ASAT LTD92 citations97
US6781242B1Aug 24, 2004
Thin ball grid array package
ASAT LTD91 citations97
US6737755B1May 18, 2004
Ball grid array package with improved thermal characteristics
ASAT LTD109 citations97
US6552417B2Apr 22, 2003
Molded plastic package with heat sink and enhanced electrical performance
ASAT LTD113 citations97
US6284569B1Sep 4, 2001
Method of manufacturing a flexible integrated circuit package utilizing an integrated carrier ring/stiffener
ASAT LTD181 citations97
US6111324AAug 29, 2000
Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package
ASAT LTD137 citations97
US7411289B1Aug 12, 2008
Integrated circuit package with partially exposed contact pads and process for fabricating the same
ASAT LTD101 citations96
US7381588B1Jun 3, 2008
Shielded integrated circuit package
ASAT LTD74 citations96
US7344920B1Mar 18, 2008
Integrated circuit package and method for fabricating same
ASAT LTD89 citations96
US7342305B1Mar 11, 2008
Thermally enhanced cavity-down integrated circuit package
ASAT LTD64 citations96
US7091581B1Aug 15, 2006
Integrated circuit package and process for fabricating the same
ASAT LTD122 citations96
US7071545B1Jul 4, 2006
Shielded integrated circuit package
ASAT LTD106 citations96
US7049177B1May 23, 2006
Leadless plastic chip carrier with standoff contacts and die attach pad
ASAT LTD192 citations96
US6984785B1Jan 10, 2006
Thermally enhanced cavity-down integrated circuit package
ASAT LTD75 citations96
US6800948B1Oct 5, 2004
Ball grid array package
ASAT LTD74 citations96
US6585905B1Jul 1, 2003
Leadless plastic chip carrier with partial etch die attach pad
ASAT LTD226 citations96
US7449771B1Nov 11, 2008
Multiple leadframe laminated IC package
ASAT LTD56 citations95
US7247526B1Jul 24, 2007
Process for fabricating an integrated circuit package
ASAT LTD134 citations95
US6818980B1Nov 16, 2004
Stacked semiconductor package and method of manufacturing the same
ASAT LTD113 citations95
US6734552B2May 11, 2004
Enhanced thermal dissipation integrated circuit package
ASAT LTD241 citations95
US6734044B1May 11, 2004
Multiple leadframe laminated IC package
ASAT LTD78 citations95
US6586834B1Jul 1, 2003
Die-up tape ball grid array package
ASAT LTD78 citations95
US6326678B1Dec 4, 2001
Molded plastic package with heat sink and enhanced electrical performance
ASAT LTD305 citations95
US6982491B1Jan 3, 2006
Sensor semiconductor package and method of manufacturing the same
ASAT LTD91 citations94
Showing the top 50 of 68 patents by PatentIndex Score.