Assignee
ASM ASSEMBLY AUTOMATION LTD
HK·95 granted patents·4 pending applications·1,359 citations·filing 1982–2010
Top patents by PatentIndex Score
99 records- 0197US7495759B1Damage and wear detection for rotary cutting bladesASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Feb 24, 2009·42 cites·14 claims
- 0295US7808133B1Dual-axis planar motor providing force constant and thermal stabilityASM ASSEMBLY AUTOMATION LTD·Filed 2009·Granted Oct 5, 2010·39 cites·11 claims
- 0392US7854365B2Direct die attach utilizing heated bond headASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Dec 21, 2010·102 cites·14 claims
- 0490US7757742B2Vibration-induced die detachment systemASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Jul 20, 2010·35 cites·17 claims
- 0588US7665204B2Die detachment apparatus comprising pre-peeling structureASM ASSEMBLY AUTOMATION LTD·Filed 2006·Granted Feb 23, 2010·18 cites·12 claims
- 0687US7470120B2Configurable die detachment apparatusASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Dec 30, 2008·13 cites·18 claims
- 0786US6386422B1Solder reflow ovenASM ASSEMBLY AUTOMATION LTD·Filed 2001·Granted May 14, 2002·54 cites·42 claims
- 0885US8037996B2Transfer apparatus for handling electronic componentsASM ASSEMBLY AUTOMATION LTD·Filed 2009·Granted Oct 18, 2011·12 cites·7 claims
- 0985US6367669B1Fluid dispensing apparatusASM ASSEMBLY AUTOMATION LTD·Filed 2000·Granted Apr 9, 2002·36 cites·13 claims
- 1084US7002283B2Ultrasonic transducer assemblyASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Feb 21, 2006·50 cites·16 claims
- 1184US6616031B2Apparatus and method for bond force controlASM ASSEMBLY AUTOMATION LTD·Filed 2001·Granted Sep 9, 2003·47 cites·19 claims
- 1283US7845543B1Apparatus and method for bonding multiple diceASM ASSEMBLY AUTOMATION LTD·Filed 2009·Granted Dec 7, 2010·8 cites·16 claims
- 1383US6967492B2Spring contact probe device for electrical testingASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Nov 22, 2005·36 cites·19 claims
- 1482US6967475B2Device transfer mechanism for a test handlerASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Nov 22, 2005·27 cites·24 claims
- 1581US7762449B2Bond head for heavy wire bonderASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Jul 27, 2010·12 cites·20 claims
- 1681US7240422B2Apparatus for semiconductor chip detachmentASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Jul 10, 2007·30 cites·16 claims
- 1781US6813225B2Linear motor driven mechanism using flexure bearings for opto-mechanical devicesASM ASSEMBLY AUTOMATION LTD·Filed 2001·Granted Nov 2, 2004·28 cites·10 claims
- 1881US6543513B1Wafer table for die bonding apparatusASM ASSEMBLY AUTOMATION LTD·Filed 2000·Granted Apr 8, 2003·33 cites·9 claims
- 1980US7727800B2High precision die bonding apparatusASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Jun 1, 2010·9 cites·10 claims
- 2079US7973259B2System for testing and sorting electronic componentsASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Jul 5, 2011·9 cites·24 claims
- 2179US7648901B2Manufacturing process and apparatus therefor utilizing reducing gasASM ASSEMBLY AUTOMATION LTD·Filed 2006·Granted Jan 19, 2010·6 cites·12 claims
- 2279US6806725B2Method and apparatus for processing an array of packaged semiconductor devicesASM ASSEMBLY AUTOMATION LTD·Filed 2002·Granted Oct 19, 2004·31 cites·24 claims
- 2379US6758113B2High speed pick and place apparatusASM ASSEMBLY AUTOMATION LTD·Filed 2001·Granted Jul 6, 2004·25 cites·8 claims
- 2477US7462926B2Leadframe comprising tin plating or an intermetallic layer formed therefromASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Dec 9, 2008·9 cites·16 claims
- 2577US7410039B2Tunable vibration absorption deviceASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Aug 12, 2008·13 cites·18 claims
- 2677US7258703B2Apparatus and method for aligning devices on carriersASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Aug 21, 2007·19 cites·16 claims
- 2777US6279810B1Piezoelectric sensor for measuring bonding parametersASM ASSEMBLY AUTOMATION LTD·Filed 2000·Granted Aug 28, 2001·32 cites·19 claims
- 2876US7810698B2Vision system for positioning a bonding toolASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Oct 12, 2010·11 cites·15 claims
- 2975US7726540B2Apparatus and method for arranging devices for processingASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Jun 1, 2010·9 cites·11 claims
- 3075US4603803AWire bonding apparatusASM ASSEMBLY AUTOMATION LTD·Filed 1985·Granted Aug 5, 1986·62 cites·4 claims
- 3174US7849896B2Bondhead alignment tool for a bonding apparatusASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Dec 14, 2010·5 cites·20 claims
- 3273US7851721B2Electronic device sorter comprising dual buffersASM ASSEMBLY AUTOMATION LTD·Filed 2009·Granted Dec 14, 2010·15 cites·18 claims
- 3372US8011058B2Singulation handler system for electronic packagesASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Sep 6, 2011·5 cites·19 claims
- 3472US7667355B2Apparatus for generating amplified cooling air flowsASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Feb 23, 2010·7 cites·11 claims
- 3572US7227295B2Piezoelectric device with amplifying mechanismASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Jun 5, 2007·8 cites·23 claims
- 3672US6655045B2Apparatus and method for pick and place handlingASM ASSEMBLY AUTOMATION LTD·Filed 2001·Granted Dec 2, 2003·15 cites·48 claims
- 3772US4606490AApparatus and method for automatic evaluation of a bond created by an ultrasonic transducerASM ASSEMBLY AUTOMATION LTD·Filed 1982·Granted Aug 19, 1986·27 cites·5 claims
- 3870US7977231B1Die bonder incorporating dual-head dispenserASM ASSEMBLY AUTOMATION LTD·Filed 2010·Granted Jul 12, 2011·5 cites·20 claims
- 3970US7246735B2Wire clamping plateASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Jul 24, 2007·5 cites·8 claims
- 4070US7182118B2Pick and place assembly for transporting a film of materialASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Feb 27, 2007·18 cites·12 claims
- 4170US6766938B2Apparatus and method of placing solder balls onto a substrateASM ASSEMBLY AUTOMATION LTD·Filed 2002·Granted Jul 27, 2004·21 cites·13 claims
- 4267US7204960B2Apparatus and method for calibration of a dispensing systemASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Apr 17, 2007·16 cites·42 claims
- 4366US8012866B2Method of bonding semiconductor devices utilizing solder ballsASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Sep 6, 2011·5 cites·19 claims
- 4466US6746022B2Chuck for holding a workpieceASM ASSEMBLY AUTOMATION LTD·Filed 2001·Granted Jun 8, 2004·12 cites·11 claims
- 4565US7733051B2Model-based active electronic damping for stepper motorsASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Jun 8, 2010·7 cites·7 claims
- 4665US7676114B2Imaging system for three-dimensional reconstruction of surface profilesASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Mar 9, 2010·7 cites·9 claims
- 4764US7145162B2Wire loop height measurement apparatus and methodASM ASSEMBLY AUTOMATION LTD·Filed 2003·Granted Dec 5, 2006·18 cites·20 claims
- 4864US6991825B2Dispensation of controlled quantities of material onto a substrateASM ASSEMBLY AUTOMATION LTD·Filed 2002·Granted Jan 31, 2006·15 cites·33 claims
- 4964US6709877B2Apparatus and method for testing semiconductor devicesASM ASSEMBLY AUTOMATION LTD·Filed 2001·Granted Mar 23, 2004·25 cites·19 claims
- 5063US7329617B2Coating for enhancing adhesion of molding compound to semiconductor devicesASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Feb 12, 2008·14 cites·21 claims
Showing the top 50 of 99 patent records by PatentIndex Score.
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