Assignee
ASMPT SINGAPORE PTE LTD
SG·32 granted patents·23 pending applications·1 citations·filing 2018–2025
Top patents by PatentIndex Score
55 records- 0187US11695915B1Apparatus and method for imaging lens alignment using a virtual test imageASMPT SINGAPORE PTE LTD·Filed 2022·Granted Jul 4, 2023·1 cites·13 claims
- 0267US2025326073A1Bond head heater incorporating fluid chamber for coolingASMPT SINGAPORE PTE LTD·Filed 2024·Application pending·0 cites
- 0364US12442744B2Apparatus and method for calibrating a shear test toolASMPT SINGAPORE PTE LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 0462US12510451B2Method and apparatus for conducting shear tests on interconnect bondsASMPT SINGAPORE PTE LTD·Filed 2023·Granted Dec 30, 2025·0 cites·22 claims
- 0560US12525571B1Compliant locating structure for a bond head assemblyASMPT SINGAPORE PTE LTD·Filed 2024·Granted Jan 13, 2026·0 cites·20 claims
- 0660US11592477B2Test handler having multiple testing sectorsASMPT SINGAPORE PTE LTD·Filed 2019·Granted Feb 28, 2023·0 cites·20 claims
- 0760US2025372459A1Inspection system for bonding lenses to image sensorsASMPT SINGAPORE PTE LTD·Filed 2024·Application pending·0 cites
- 0859US12533818B2Pick-up chuck with gas bearing structureASMPT SINGAPORE PTE LTD·Filed 2022·Granted Jan 27, 2026·0 cites·18 claims
- 0959US12304002B2Laser-cutting using selective polarizationASMPT SINGAPORE PTE LTD·Filed 2021·Granted May 20, 2025·0 cites·6 claims
- 1059US2025157830A1Method for manufacturing integrated device packagesASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 1159US2025076184A1Defect inspection method and apparatus for electronic devicesASMPT SINGAPORE PTE LTD·Filed 2024·Application pending·0 cites
- 1258US2025360559A1Wet-tack sintering method and apparatusASMPT SINGAPORE PTE LTD·Filed 2024·Application pending·0 cites
- 1357US12396084B2Dielectric barrier discharge plasma generatorASMPT SINGAPORE PTE LTD·Filed 2023·Granted Aug 19, 2025·0 cites·14 claims
- 1457US2025022727A1Die bonder having a rotary bond arm actuatorASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 1556US12081868B2Aligning optical components along a predetermined reference optical pathASMPT SINGAPORE PTE LTD·Filed 2021·Granted Sep 3, 2024·0 cites·14 claims
- 1656US11842978B1Wire bonding system including a wire biasing toolASMPT SINGAPORE PTE LTD·Filed 2022·Granted Dec 12, 2023·0 cites·10 claims
- 1756US2025379085A1Precise bond head alignment utilizing a universal reference plateASMPT SINGAPORE PTE LTD·Filed 2025·Application pending·0 cites
- 1856US2025178845A1Apparatus and method for handling carrier rings mounted with electronic devicesASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 1954US12599022B2Apparatus for applying a sintering force via a compressible filmASMPT SINGAPORE PTE LTD·Filed 2022·Granted Apr 7, 2026·0 cites·12 claims
- 2054US11618172B2Ejector unit for detaching an electronic element from an adhesive carrierASMPT SINGAPORE PTE LTD·Filed 2021·Granted Apr 4, 2023·0 cites·10 claims
- 2154US11622485B1Flexural pick arm for a pick and place apparatusASMPT SINGAPORE PTE LTD·Filed 2021·Granted Apr 4, 2023·0 cites·16 claims
- 2254US2024170442A1Hybrid bonding of a thin semiconductor dieASMPT SINGAPORE PTE LTD·Filed 2022·Application pending·0 cites
- 2353US12457399B2Camera module assemblyASMPT SINGAPORE PTE LTD·Filed 2023·Granted Oct 28, 2025·0 cites·17 claims
- 2453US2025389952A1Automated particle removal method and systemASMPT SINGAPORE PTE LTD·Filed 2025·Application pending·0 cites
- 2553US2024262019A1Molding apparatus having wedge driverASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 2652US12492893B2Passive alignment of lens module relative to an image sensor for manufacturing a camera moduleASMPT SINGAPORE PTE LTD·Filed 2022·Granted Dec 9, 2025·0 cites·19 claims
- 2752US12392390B2Apparatus and method for vibration attenuationASMPT SINGAPORE PTE LTD·Filed 2023·Granted Aug 19, 2025·0 cites·17 claims
- 2852US2026026302A1Combined long-stroke and short-stroke positioning stageASMPT SINGAPORE PTE LTD·Filed 2024·Application pending·0 cites
- 2952US2024194634A1Handling a fragile substrate for interconnect bondingASMPT SINGAPORE PTE LTD·Filed 2022·Application pending·0 cites
- 3052US2024339430A1System and method for fluxless thermocompression bondingASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 3151US12072251B2Force measurement device and method for bonding or encapsulation process and apparatus incorporating the deviceASMPT SINGAPORE PTE LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 3251US2025071962A1Bond head having individually-displaceable bond armsASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 3351US2024347500A1Wire path plate having enhanced durability for wire bondingASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 3450US11543362B2Method for measuring the heights of wire interconnectionsASMPT SINGAPORE PTE LTD·Filed 2020·Granted Jan 3, 2023·0 cites·10 claims
- 3550US11467270B2Apparatus and method for calibrating or testing an imaging deviceASMPT SINGAPORE PTE LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 3650US2025100130A1Bonding machine bond head having six degrees of freedomASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 3750US2024264524A1Combined dispensing and stamping apparatus and method for applying adhesive fluid during a bonding processASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 3850US2025031357A1Bonding tool incorporating decoupled motion axesASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 3949US11955347B2Encapsulation process for double-sided cooled packagesASMPT SINGAPORE PTE LTD·Filed 2021·Granted Apr 9, 2024·0 cites·16 claims
- 4049US11559823B2Volumetric measurement and regulation device incorporated in a time-pressure dispenserASMPT SINGAPORE PTE LTD·Filed 2020·Granted Jan 24, 2023·0 cites·20 claims
- 4148US11764098B2Detaching a die from an adhesive tape by air ejectionASMPT SINGAPORE PTE LTD·Filed 2021·Granted Sep 19, 2023·0 cites·16 claims
- 4248US2024116127A1Ultrasonic transducer operable at multiple resonant frequenciesASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 4347US11552031B2High precision bonding apparatus comprising heaterASMPT SINGAPORE PTE LTD·Filed 2020·Granted Jan 10, 2023·0 cites·18 claims
- 4445US11798911B1Force sensor in an ultrasonic wire bonding deviceASMPT SINGAPORE PTE LTD·Filed 2022·Granted Oct 24, 2023·0 cites·12 claims
- 4545US11548273B2Apparatus and method for removing a film from a surfaceASMPT SINGAPORE PTE LTD·Filed 2020·Granted Jan 10, 2023·0 cites·13 claims
- 4645US2024268933A1Syringe housing for enhancing fluid dispensing stabilityASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 4745US2024116126A1Ultrasonic transducer operable at multiple resonant frequenciesASMPT SINGAPORE PTE LTD·Filed 2022·Application pending·0 cites
- 4844US11676937B2Flexible sinter tool for bonding semiconductor devicesASMPT SINGAPORE PTE LTD·Filed 2021·Granted Jun 13, 2023·0 cites·18 claims
- 4943US11600516B2Die ejector height adjustmentASMPT SINGAPORE PTE LTD·Filed 2020·Granted Mar 7, 2023·0 cites·15 claims
- 5043US2024359329A1Picking an electronic component from a reusable adhesive tapeASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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