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DE19 patents

Top patents by PatentIndex Score

US8735232B2May 27, 2014

Methods for forming semiconductor devices

BAARS PETER21 citations93
US8647938B1Feb 11, 2014

SRAM integrated circuits with buried saddle-shaped FINFET and methods for their fabrication

BAARS PETER22 citations93
US8927407B2Jan 6, 2015

Method of forming self-aligned contacts for a semiconductor device

BAARS PETER9 citations83
US8846513B2Sep 30, 2014

Semiconductor device comprising replacement gate electrode structures and self-aligned contact elements formed by a late contact fill

BAARS PETER6 citations73
US8647952B2Feb 11, 2014

Encapsulation of closely spaced gate electrode structures

BAARS PETER4 citations73
US8609457B2Dec 17, 2013

Semiconductor device with DRAM bit lines made from same material as gate electrodes in non-memory regions of the device, and methods of making same

BAARS PETER5 citations73
US8790975B2Jul 29, 2014

Semiconductor device comprising a capacitor formed in the metallization system based on dummy metal features

BAARS PETER6 citations72
US8853810B2Oct 7, 2014

Integrated circuits that include deep trench capacitors and methods for their fabrication

BAARS PETER2 citations63
US8575013B2Nov 5, 2013

Replacement gate fabrication methods

BAARS PETER2 citations63
US8222103B1Jul 17, 2012

Semiconductor device with embedded low-K metallization

BAARS PETER5 citations63
US9023696B2May 5, 2015

Method of forming contacts for devices with multiple stress liners

BAARS PETER3 citations61
US8293605B2Oct 23, 2012

Methods for fabricating a CMOS integrated circuit having a dual stress layer (DSL)

BAARS PETER3 citations61
US9484457B2Nov 1, 2016

Vertical floating body storage transistors formed in bulk devices and having buried sense and word lines

BAARS PETER1 citations52
US8835245B2Sep 16, 2014

Semiconductor device comprising self-aligned contact elements

BAARS PETER1 citations52
US8697557B2Apr 15, 2014

Method of removing gate cap materials while protecting active area

BAARS PETER1 citations52
US8513083B2Aug 20, 2013

Methods of forming an anode and a cathode of a substrate diode by performing angled ion implantation processes

BAARS PETER0 citations52
US8673696B2Mar 18, 2014

SOI semiconductor device comprising a substrate diode with reduced metal silicide leakage

BAARS PETER0 citations49
US8883586B2Nov 11, 2014

Mol insitu Pt rework sequence

BAARS PETER0 citations48
US8987104B2Mar 24, 2015

Method of forming spacers that provide enhanced protection for gate electrode structures

BAARS PETER0 citations42