Assignee
BADAKERE GOVINDAIAH GURUPRASAD
SG·2 granted patents·1 citations·filing 2007–2011
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0154US8120150B2Integrated circuit package system with dual connectivityBADAKERE GOVINDAIAH GURUPRASAD·Filed 2007·Granted Feb 21, 2012·1 cites·20 claims
- 0245US8153478B2Method for manufacturing integrated circuit package system with under paddle leadfingersBADAKERE GOVINDAIAH GURUPRASAD·Filed 2011·Granted Apr 10, 2012·0 cites·10 claims
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