Assignee
BAE HYUNIL
KR·2 granted patents·6 citations·filing 2008–2009
Top patents by PatentIndex Score
2 records- 0158US9559046B2Semiconductor device and method of forming a fan-in package-on-package structure using through silicon viasBAE HYUNIL·Filed 2008·Granted Jan 31, 2017·4 cites·24 claims
- 0256US8816487B2Integrated circuit packaging system with package-in-package and method of manufacture thereofBAE HYUNIL·Filed 2009·Granted Aug 26, 2014·2 cites·16 claims
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