Assignee

BAUMANN DAMIAN

0 granted patents·1 pending application·0 citations·filing 2007–2007

Technology mixB23K1 H10P1 H10W1

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1 record

0137US2010019018A1Method And Device For Wetting The Bumps Of A Semiconductor Chip With Soldering FluxBAUMANN DAMIAN·Filed 2007·Application pending·0 cites

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