Assignee
BAYERER REINHOLD
DE·21 granted patents·3 pending applications·143 citations·filing 2006–2012
Top patents by PatentIndex Score
24 records- 0193US8593817B2Power semiconductor module and method for operating a power semiconductor moduleBAYERER REINHOLD·Filed 2010·Granted Nov 26, 2013·19 cites·25 claims
- 0292US8120391B2Circuit arrangement including a voltage supply circuit and semiconductor switching elementBAYERER REINHOLD·Filed 2009·Granted Feb 21, 2012·20 cites·10 claims
- 0391US8319335B2Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assemblyBAYERER REINHOLD·Filed 2010·Granted Nov 27, 2012·14 cites·25 claims
- 0490US8487407B2Low impedance gate control method and apparatusBAYERER REINHOLD·Filed 2011·Granted Jul 16, 2013·12 cites·21 claims
- 0588US9106124B2Low-inductance power semiconductor assemblyBAYERER REINHOLD·Filed 2011·Granted Aug 11, 2015·10 cites·8 claims
- 0687US8222928B2Circuit arrangement including voltage supply circuitBAYERER REINHOLD·Filed 2009·Granted Jul 17, 2012·14 cites·14 claims
- 0787US8154114B2Power semiconductor moduleBAYERER REINHOLD·Filed 2007·Granted Apr 10, 2012·16 cites·42 claims
- 0884US9688060B2Method for producing a composite and a power semiconductor moduleBAYERER REINHOLD·Filed 2012·Granted Jun 27, 2017·4 cites·29 claims
- 0984US8992267B2Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and an electrically conductive second connectorBAYERER REINHOLD·Filed 2010·Granted Mar 31, 2015·6 cites·19 claims
- 1081US8466548B2Semiconductor device including excess solderBAYERER REINHOLD·Filed 2011·Granted Jun 18, 2013·7 cites·25 claims
- 1180US8823175B2Reliable area joints for power semiconductorsBAYERER REINHOLD·Filed 2012·Granted Sep 2, 2014·5 cites·27 claims
- 1270US10104812B2Elastic mounting of power modulesBAYERER REINHOLD·Filed 2011·Granted Oct 16, 2018·3 cites·1 claims
- 1369US8317525B2Press-fit connections for electronic modulesBAYERER REINHOLD·Filed 2011·Granted Nov 27, 2012·6 cites·10 claims
- 1461US8999758B2Fixing semiconductor die in dry and pressure supported assembly processesBAYERER REINHOLD·Filed 2011·Granted Apr 7, 2015·1 cites·11 claims
- 1561US8167187B2Method and device for producing a bondable area region on a carrierBAYERER REINHOLD·Filed 2006·Granted May 1, 2012·2 cites·22 claims
- 1660US9793889B2Semiconductor device including a circuit to compensate for parasitic inductanceBAYERER REINHOLD·Filed 2011·Granted Oct 17, 2017·2 cites·22 claims
- 1756US8472949B2Semiconductor assemblyBAYERER REINHOLD·Filed 2006·Granted Jun 25, 2013·1 cites·31 claims
- 1853US8222741B2Semiconductor module with current connection elementBAYERER REINHOLD·Filed 2007·Granted Jul 17, 2012·1 cites·15 claims
- 1950US8148845B2Circuit assembly including a power semiconductor module and a controllerBAYERER REINHOLD·Filed 2009·Granted Apr 3, 2012·0 cites·22 claims
- 2043US2007145576A1Power Semiconductor Circuit And Method Of Manufacturing A Power Semiconductor CircuitBAYERER REINHOLD·Filed 2006·Application pending·0 cites
- 2143US2007007280A1Method for producing a circuit moduleBAYERER REINHOLD·Filed 2006·Application pending·0 cites
- 2242US8198721B2Semiconductor moduleBAYERER REINHOLD·Filed 2006·Granted Jun 12, 2012·0 cites·15 claims
- 2339US2012175755A1Semiconductor device including a heat spreaderBAYERER REINHOLD·Filed 2011·Application pending·0 cites
- 2438US8309395B2Method of fabricating a high-temperature compatible power semiconductor moduleBAYERER REINHOLD·Filed 2010·Granted Nov 13, 2012·0 cites·19 claims
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