Assignee
BERGERSON ANTHONY P
US·2 granted patents·1 citations·filing 2005–2012
Top patents by PatentIndex Score
2 records- 0165US8625250B2Compression-molded parts having an embedded conductive layer and method for making sameBERGERSON ANTHONY P·Filed 2012·Granted Jan 7, 2014·1 cites·4 claims
- 0246US9895831B2Compression-molded parts having an embedded conductive layer and method for making sameBERGERSON ANTHONY P·Filed 2005·Granted Feb 20, 2018·0 cites·7 claims
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