Assignee
BESI NETHERLANDS BV
NL15 patents
Top patents by PatentIndex Score
US11217463B2Jan 4, 2022
Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
BESI NETHERLANDS BV2 citations64
US11842909B2Dec 12, 2023
Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
BESI NETHERLANDS BV0 citations54
US12384081B2Aug 12, 2025
Mould half and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such
BESI NETHERLANDS BV0 citations52
US12420465B2Sep 23, 2025
Method and mould for encapsulating electronic components mounted on a carrier
BESI NETHERLANDS BV0 citations46
US9435584B2Sep 6, 2016
Device and method for separating, at least partially drying and inspecting electronic components
BESI NETHERLANDS BV0 citations44
US11935764B2Mar 19, 2024
Sawing device and method for forming saw-cuts into a semiconductor product
BESI NETHERLANDS BV0 citations43
US11450550B2Sep 20, 2022
Handler device for handling substrates
BESI NETHERLANDS BV0 citations43
US10913191B2Feb 9, 2021
Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic components and moulded product
BESI NETHERLANDS BV0 citations41
US10720340B2Jul 21, 2020
Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components
BESI NETHERLANDS BV0 citations41
US10032653B2Jul 24, 2018
Mould, carrier with encapsulated electronic components, separated encapsulated electronic component and method for encapsulating electronic components
BESI NETHERLANDS BV0 citations41
US11554523B2Jan 17, 2023
Press part for supporting a mould part for encapsulating electronic components mounted on a carrier and a press comprising the press part
BESI NETHERLANDS BV0 citations38
US10699924B2Jun 30, 2020
Modular system for moulding electronic components and kit-of-parts for assembling such a modular system
BESI NETHERLANDS BV0 citations38
US11887872B2Jan 30, 2024
Method and device for selectively separating electronic components from a frame with electronic components
BESI NETHERLANDS BV0 citations37
US9831105B2Nov 28, 2017
Method for moulding and surface processing electronic components and electronic component produced with this method
BESI NETHERLANDS BV0 citations35
US10217679B2Feb 26, 2019
Method for positioning a carrier with electronic components and electronic component produced with such method
BESI NETHERLANDS BV0 citations33