Assignee
BEZAMA RASCHID JOSE
US·5 granted patents·2 pending applications·52 citations·filing 2007–2012
Top patents by PatentIndex Score
7 records- 0193US8115303B2Semiconductor package structures having liquid coolers integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2008·Granted Feb 14, 2012·28 cites·11 claims
- 0291US8772927B2Semiconductor package structures having liquid cooler integrated with first level chip package modulesBEZAMA RASCHID JOSE·Filed 2011·Granted Jul 8, 2014·12 cites·10 claims
- 0381US8505617B2Structure and apparatus for cooling integrated circuits using copper microchannelsBEZAMA RASCHID JOSE·Filed 2012·Granted Aug 13, 2013·3 cites·6 claims
- 0478US8210243B2Structure and apparatus for cooling integrated circuits using cooper microchannelsBEZAMA RASCHID JOSE·Filed 2008·Granted Jul 3, 2012·4 cites·13 claims
- 0571US8418751B2Stacked and redundant chip coolersBEZAMA RASCHID JOSE·Filed 2008·Granted Apr 16, 2013·5 cites·7 claims
- 0648US2009039140A1Solder Mold With Venting ChannelsBEZAMA RASCHID JOSE·Filed 2007·Application pending·0 cites
- 0748US2009039142A1Method for Forming a Solder Mold with Venting Channels and Method for Using the SameBEZAMA RASCHID JOSE·Filed 2007·Application pending·0 cites
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