Assignee
BILLS KEVIN
US·3 granted patents·6 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0182US8389870B2Coreless multi-layer circuit substrate with minimized pad capacitanceBILLS KEVIN·Filed 2010·Granted Mar 5, 2013·6 cites·2 claims
- 0251US8975525B2Corles multi-layer circuit substrate with minimized pad capacitanceBILLS KEVIN·Filed 2012·Granted Mar 10, 2015·0 cites·3 claims
- 0348US9060428B2Coreless multi-layer circuit substrate with minimized pad capacitanceBILLS KEVIN·Filed 2012·Granted Jun 16, 2015·0 cites·2 claims
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