Individual holder
BODENWEBER PAUL F
US·4 granted patents·7 citations·filing 2011–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
4 records- 0181US8794079B2Determining magnitude of compressive loadingBODENWEBER PAUL F·Filed 2011·Granted Aug 5, 2014·3 cites·9 claims
- 0274US9226426B2Electronic device console with natural draft coolingBODENWEBER PAUL F·Filed 2012·Granted Dec 29, 2015·2 cites·18 claims
- 0368US8717043B2Determining thermal interface material (TIM) thickness changeBODENWEBER PAUL F·Filed 2011·Granted May 6, 2014·2 cites·19 claims
- 0444US9105500B2Non-hermetic sealed multi-chip module packageBODENWEBER PAUL F·Filed 2012·Granted Aug 11, 2015·0 cites·14 claims
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