Assignee
BONDTECH CO LTD
JP·10 granted patents·6 pending applications·19 citations·filing 2015–2023
Top patents by PatentIndex Score
16 records- 0196US10580752B2Method for bonding substrates together, and substrate bonding deviceBONDTECH CO LTD·Filed 2015·Granted Mar 3, 2020·9 cites·23 claims
- 0289US11587804B2Component mounting systemBONDTECH CO LTD·Filed 2018·Granted Feb 21, 2023·5 cites·26 claims
- 0383US12094747B2Substrate bonding deviceBONDTECH CO LTD·Filed 2019·Granted Sep 17, 2024·3 cites·4 claims
- 0480US12261147B2Bonding system and bonding methodBONDTECH CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·1 claims
- 0579US12388045B2Bonding system and bonding methodBONDTECH CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·19 claims
- 0675US9379082B2Pressure application apparatus and pressure application methodBONDTECH CO LTD·Filed 2015·Granted Jun 28, 2016·2 cites·18 claims
- 0772US12341036B2Resin shaping deviceBONDTECH CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·17 claims
- 0865US2026054329A1Substrate bonding system and substrate bonding methodBONDTECH CO LTD·Filed 2022·Application pending·0 cites
- 0958US12409644B2Substrate bonding method and substrate bonding systemBONDTECH CO LTD·Filed 2021·Granted Sep 9, 2025·0 cites·15 claims
- 1053US2024174457A1Bonding system and bonding methodBONDTECH CO LTD·Filed 2022·Application pending·0 cites
- 1153US2024162063A1Bonding device, bonding system, and bonding methodBONDTECH CO LTD·Filed 2022·Application pending·0 cites
- 1252US2024304594A1Bonding method, substrate bonding device, and substrate bonding systemBONDTECH CO LTD·Filed 2022·Application pending·0 cites
- 1350US2023307284A1Chip bonding system and chip bonding methodBONDTECH CO LTD·Filed 2021·Application pending·0 cites
- 1448US11837444B2Substrate joining method, substrate joining system and method for controlling hydrophilic treatment deviceBONDTECH CO LTD·Filed 2017·Granted Dec 5, 2023·0 cites·17 claims
- 1546US2023030272A1Bonding method, bonded article, and bonding deviceBONDTECH CO LTD·Filed 2020·Application pending·0 cites
- 1641US12261070B2Component mounting system and component mounting methodBONDTECH CO LTD·Filed 2018·Granted Mar 25, 2025·0 cites·8 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →