Assignee
BOWER CHRISTOPHER
US6 patents
Top patents by PatentIndex Score
US8934259B2Jan 13, 2015
Substrates with transferable chiplets
BOWER CHRISTOPHER146 citations99
US8889485B2Nov 18, 2014
Methods for surface attachment of flipped active componenets
BOWER CHRISTOPHER339 citations99
US8877648B2Nov 4, 2014
Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby
BOWER CHRISTOPHER249 citations99
US9165989B2Oct 20, 2015
High-yield fabrication of large-format substrates with distributed, independent control elements
BOWER CHRISTOPHER65 citations97
US9899329B2Feb 20, 2018
Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
BOWER CHRISTOPHER19 citations94
US9142468B2Sep 22, 2015
Structures and methods for testing printable integrated circuits
BOWER CHRISTOPHER31 citations94