Assignee
BRIDGE SEMICONDUCTOR CORP
TW·123 granted patents·62 pending applications·3,141 citations·filing 1998–2025
Top patents by PatentIndex Score
185 records- 0199US7750483B1Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminalBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Jul 6, 2010·109 cites·130 claims
- 0299US7262082B1Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant apertureBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Aug 28, 2007·134 cites·200 claims
- 0398US7417314B1Semiconductor chip assembly with laterally aligned bumped terminal and fillerBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Aug 26, 2008·65 cites·100 claims
- 0498US7268421B1Semiconductor chip assembly with welded metal pillar that includes enlarged ball bondBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Sep 11, 2007·93 cites·100 claims
- 0598US7067911B1Three-dimensional stacked semiconductor package with metal pillar in encapsulant apertureBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Jun 27, 2006·161 cites·150 claims
- 0698US7009297B1Semiconductor chip assembly with embedded metal particleBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Mar 7, 2006·158 cites·110 claims
- 0797US7538415B1Semiconductor chip assembly with bumped terminal, filler and insulative baseBRIDGE SEMICONDUCTOR CORP·Filed 2007·Granted May 26, 2009·57 cites·100 claims
- 0897US7446419B1Semiconductor chip assembly with welded metal pillar of stacked metal ballsBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Nov 4, 2008·59 cites·150 claims
- 0996US7071573B1Semiconductor chip assembly with welded metal pillarBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Jul 4, 2006·86 cites·230 claims
- 1096US6809414B1Semiconductor chip assembly with bumped conductive traceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Oct 26, 2004·73 cites·120 claims
- 1196US6744126B1Multichip semiconductor package deviceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Jun 1, 2004·91 cites·40 claims
- 1296US6486549B1Semiconductor module with encapsulant baseBRIDGE SEMICONDUCTOR CORP·Filed 2001·Granted Nov 26, 2002·134 cites·70 claims
- 1395US10134711B2Thermally enhanced semiconductor assembly with three dimensional integration and method of making the sameBRIDGE SEMICONDUCTOR CORP·Filed 2017·Granted Nov 20, 2018·12 cites·7 claims
- 1495US7993983B1Method of making a semiconductor chip assembly with chip and encapsulant grindingBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Aug 9, 2011·39 cites·60 claims
- 1595US6740576B1Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assemblyBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted May 25, 2004·105 cites·280 claims
- 1694US10804205B1Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the sameBRIDGE SEMICONDUCTOR CORP·Filed 2019·Granted Oct 13, 2020·10 cites·21 claims
- 1794US7948076B2Semiconductor chip assembly with post/base heat spreader and vertical signal routingBRIDGE SEMICONDUCTOR CORP·Filed 2009·Granted May 24, 2011·26 cites·35 claims
- 1894US7190060B1Three-dimensional stacked semiconductor package device with bent and flat leads and method of making sameBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Mar 13, 2007·92 cites·115 claims
- 1994US6794741B1Three-dimensional stacked semiconductor package with pillars in pillar cavitiesBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Sep 21, 2004·77 cites·180 claims
- 2094US6353324B1Electronic circuitBRIDGE SEMICONDUCTOR CORP·Filed 1999·Granted Mar 5, 2002·174 cites·37 claims
- 2192US10420204B2Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the sameBRIDGE SEMICONDUCTOR CORP·Filed 2015·Granted Sep 17, 2019·10 cites·2 claims
- 2292US9318411B2Semiconductor package with package-on-package stacking capability and method of manufacturing the sameBRIDGE SEMICONDUCTOR CORP·Filed 2014·Granted Apr 19, 2016·12 cites·9 claims
- 2392US7901993B2Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive traceBRIDGE SEMICONDUCTOR CORP·Filed 2010·Granted Mar 8, 2011·11 cites·35 claims
- 2492US7319265B1Semiconductor chip assembly with precision-formed metal pillarBRIDGE SEMICONDUCTOR CORP·Filed 2005·Granted Jan 15, 2008·27 cites·40 claims
- 2592US6716670B1Method of forming a three-dimensional stacked semiconductor package deviceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Apr 6, 2004·45 cites·80 claims
- 2691US10242964B1Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the sameBRIDGE SEMICONDUCTOR CORP·Filed 2018·Granted Mar 26, 2019·7 cites·17 claims
- 2791US7494843B1Method of making a semiconductor chip assembly with thermal conductor and encapsulant grindingBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Feb 24, 2009·23 cites·100 claims
- 2890US8343808B2Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitryBRIDGE SEMICONDUCTOR CORP·Filed 2011·Granted Jan 1, 2013·12 cites·37 claims
- 2990US8003415B2Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routingBRIDGE SEMICONDUCTOR CORP·Filed 2009·Granted Aug 23, 2011·18 cites·25 claims
- 3090US7190080B1Semiconductor chip assembly with embedded metal pillarBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Mar 13, 2007·82 cites·115 claims
- 3190US6803651B1Optoelectronic semiconductor package deviceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Oct 12, 2004·38 cites·154 claims
- 3289US10269722B2Wiring board having component integrated with leadframe and method of making the sameBRIDGE SEMICONDUCTOR CORP·Filed 2018·Granted Apr 23, 2019·5 cites·12 claims
- 3389US10211067B1Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assemblyBRIDGE SEMICONDUCTOR CORP·Filed 2018·Granted Feb 19, 2019·6 cites·18 claims
- 3489US10199321B2Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the sameBRIDGE SEMICONDUCTOR CORP·Filed 2017·Granted Feb 5, 2019·6 cites·3 claims
- 3589US9349711B2Semiconductor device with face-to-face chips on interposer and method of manufacturing the sameBRIDGE SEMICONDUCTOR CORP·Filed 2015·Granted May 24, 2016·6 cites·14 claims
- 3689US9209154B2Semiconductor package with package-on-package stacking capability and method of manufacturing the sameBRIDGE SEMICONDUCTOR CORP·Filed 2014·Granted Dec 8, 2015·10 cites·12 claims
- 3789US7075186B1Semiconductor chip assembly with interlocked contact terminalBRIDGE SEMICONDUCTOR CORP·Filed 2005·Granted Jul 11, 2006·17 cites·60 claims
- 3889US6774659B1Method of testing a semiconductor package deviceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Aug 10, 2004·36 cites·40 claims
- 3989US6583040B1Method of making a pillar in a laminated structure for a semiconductor chip assemblyBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Jun 24, 2003·37 cites·200 claims
- 4087US7015128B1Method of making a semiconductor chip assembly with an embedded metal particleBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Mar 21, 2006·34 cites·210 claims
- 4187US6876072B1Semiconductor chip assembly with chip in substrate cavityBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Apr 5, 2005·47 cites·200 claims
- 4287US6593224B1Method of manufacturing a multilayer interconnect substrateBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Jul 15, 2003·39 cites·100 claims
- 4387US6576493B1Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch stepsBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Jun 10, 2003·44 cites·100 claims
- 4486US10354984B2Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the sameBRIDGE SEMICONDUCTOR CORP·Filed 2016·Granted Jul 16, 2019·5 cites·11 claims
- 4586US7939375B2Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the postBRIDGE SEMICONDUCTOR CORP·Filed 2010·Granted May 10, 2011·8 cites·35 claims
- 4686US7656031B2Stackable semiconductor package having metal pin within through hole of packageBRIDGE SEMICONDUCTOR CORP·Filed 2007·Granted Feb 2, 2010·19 cites·7 claims
- 4786US7419851B2Method of making a semiconductor chip assembly with a metal containment wall and a solder terminalBRIDGE SEMICONDUCTOR CORP·Filed 2005·Granted Sep 2, 2008·13 cites·200 claims
- 4886US7414319B2Semiconductor chip assembly with metal containment wall and solder terminalBRIDGE SEMICONDUCTOR CORP·Filed 2005·Granted Aug 19, 2008·13 cites·100 claims
- 4986US7396703B1Method of making a semiconductor chip assembly with a bumped terminal and a fillerBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Jul 8, 2008·9 cites·100 claims
- 5086US7232707B1Method of making a semiconductor chip assembly with an interlocked contact terminalBRIDGE SEMICONDUCTOR CORP·Filed 2005·Granted Jun 19, 2007·13 cites·140 claims
Showing the top 50 of 185 patent records by PatentIndex Score.
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