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CABOT MICROELECTRONICS CORP
US251 patents
Top patents by PatentIndex Score
US6913517B2Jul 5, 2005
Microporous polishing pads
CABOT MICROELECTRONICS CORP89 citations99
US6217416B1Apr 17, 2001
Chemical mechanical polishing slurry useful for copper/tantalum substrates
CABOT MICROELECTRONICS CORP202 citations99
US6126853AOct 3, 2000
Chemical mechanical polishing slurry useful for copper substrates
CABOT MICROELECTRONICS CORP116 citations99
US6582623B1Jun 24, 2003
CMP composition containing silane modified abrasive particles
CABOT MICROELECTRONICS CORP143 citations98
US6177026B1Jan 23, 2001
CMP slurry containing a solid catalyst
CABOT MICROELECTRONICS CORP111 citations98
US7998335B2Aug 16, 2011
Controlled electrochemical polishing method
CABOT MICROELECTRONICS CORP77 citations97
US6884156B2Apr 26, 2005
Multi-layer polishing pad material for CMP
CABOT MICROELECTRONICS CORP77 citations97
US6293848B1Sep 25, 2001
Composition and method for planarizing surfaces
CABOT MICROELECTRONICS CORP86 citations97
US6935931B2Aug 30, 2005
Microporous polishing pads
CABOT MICROELECTRONICS CORP44 citations96
US6936543B2Aug 30, 2005
CMP method utilizing amphiphilic nonionic surfactants
CABOT MICROELECTRONICS CORP82 citations96
US6776810B1Aug 17, 2004
Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
CABOT MICROELECTRONICS CORP112 citations96
US6646348B1Nov 11, 2003
Silane containing polishing composition for CMP
CABOT MICROELECTRONICS CORP48 citations96
US6593239B2Jul 15, 2003
Chemical mechanical polishing method useful for copper substrates
CABOT MICROELECTRONICS CORP56 citations96
US6527622B1Mar 4, 2003
CMP method for noble metals
CABOT MICROELECTRONICS CORP131 citations96
US6461227B1Oct 8, 2002
Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing composition
CABOT MICROELECTRONICS CORP52 citations96
US6435947B2Aug 20, 2002
CMP polishing pad including a solid catalyst
CABOT MICROELECTRONICS CORP55 citations96
US6432828B2Aug 13, 2002
Chemical mechanical polishing slurry useful for copper substrates
CABOT MICROELECTRONICS CORP58 citations96
US6395693B1May 28, 2002
Cleaning solution for semiconductor surfaces following chemical-mechanical polishing
CABOT MICROELECTRONICS CORP43 citations96
US6383065B1May 7, 2002
Catalytic reactive pad for metal CMP
CABOT MICROELECTRONICS CORP51 citations96
US7071105B2Jul 4, 2006
Method of polishing a silicon-containing dielectric
CABOT MICROELECTRONICS CORP57 citations95
US6821897B2Nov 23, 2004
Method for copper CMP using polymeric complexing agents
CABOT MICROELECTRONICS CORP60 citations95
US6689692B1Feb 10, 2004
Composition for oxide CMP
CABOT MICROELECTRONICS CORP56 citations95
US6620037B2Sep 16, 2003
Chemical mechanical polishing slurry useful for copper substrates
CABOT MICROELECTRONICS CORP80 citations95
US6431953B1Aug 13, 2002
CMP process involving frequency analysis-based monitoring
CABOT MICROELECTRONICS CORP57 citations95
US6447371B2Sep 10, 2002
Chemical mechanical polishing slurry useful for copper/tantalum substrates
CABOT MICROELECTRONICS CORP58 citations94
US6840971B2Jan 11, 2005
Chemical mechanical polishing systems and methods for their use
CABOT MICROELECTRONICS CORP30 citations93
US6641630B1Nov 4, 2003
CMP compositions containing iodine and an iodine vapor-trapping agent
CABOT MICROELECTRONICS CORP45 citations93
US6604987B1Aug 12, 2003
CMP compositions containing silver salts
CABOT MICROELECTRONICS CORP45 citations93
US6541434B2Apr 1, 2003
Cleaning solution for semiconductor surfaces following chemical-mechanical polishing
CABOT MICROELECTRONICS CORP26 citations93
US6362104B1Mar 26, 2002
Method for polishing a substrate using a CMP slurry
CABOT MICROELECTRONICS CORP42 citations93
US6316366B1Nov 13, 2001
Method of polishing using multi-oxidizer slurry
CABOT MICROELECTRONICS CORP36 citations93
US9127187B1Sep 8, 2015
Mixed abrasive tungsten CMP composition
CABOT MICROELECTRONICS CORP24 citations92
US7994057B2Aug 9, 2011
Polishing composition and method utilizing abrasive particles treated with an aminosilane
CABOT MICROELECTRONICS CORP30 citations92
US7699684B2Apr 20, 2010
CMP porous pad with component-filled pores
CABOT MICROELECTRONICS CORP36 citations92
US7582127B2Sep 1, 2009
Polishing composition for a tungsten-containing substrate
CABOT MICROELECTRONICS CORP21 citations92
US7442645B2Oct 28, 2008
Method of polishing a silicon-containing dielectric
CABOT MICROELECTRONICS CORP25 citations92
US7435161B2Oct 14, 2008
Multi-layer polishing pad material for CMP
CABOT MICROELECTRONICS CORP31 citations92
US7435165B2Oct 14, 2008
Transparent microporous materials for CMP
CABOT MICROELECTRONICS CORP40 citations92
US7311862B2Dec 25, 2007
Method for manufacturing microporous CMP materials having controlled pore size
CABOT MICROELECTRONICS CORP34 citations92
US7267607B2Sep 11, 2007
Transparent microporous materials for CMP
CABOT MICROELECTRONICS CORP37 citations92
US7264641B2Sep 4, 2007
Polishing pad comprising biodegradable polymer
CABOT MICROELECTRONICS CORP38 citations92
US7265055B2Sep 4, 2007
CMP of copper/ruthenium substrates
CABOT MICROELECTRONICS CORP33 citations92
US7204742B2Apr 17, 2007
Polishing pad comprising hydrophobic region and endpoint detection port
CABOT MICROELECTRONICS CORP31 citations92
US7195544B2Mar 27, 2007
CMP porous pad with component-filled pores
CABOT MICROELECTRONICS CORP29 citations92
US7059936B2Jun 13, 2006
Low surface energy CMP pad
CABOT MICROELECTRONICS CORP23 citations92
US6998166B2Feb 14, 2006
Polishing pad with oriented pore structure
CABOT MICROELECTRONICS CORP42 citations92
US6984588B2Jan 10, 2006
Compositions for oxide CMP
CABOT MICROELECTRONICS CORP21 citations92
US6976905B1Dec 20, 2005
Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system
CABOT MICROELECTRONICS CORP34 citations92
US6960120B2Nov 1, 2005
CMP pad with composite transparent window
CABOT MICROELECTRONICS CORP28 citations92
US6899598B2May 31, 2005
Microporous polishing pads
CABOT MICROELECTRONICS CORP14 citations92
Showing the top 50 of 251 patents by PatentIndex Score.