Assignee
CABOT MICROELECTRONICS CORP
US·251 granted patents·83 pending applications·4,524 citations·filing 1997–2020
Top patents by PatentIndex Score
334 records- 0198US6913517B2Microporous polishing padsCABOT MICROELECTRONICS CORP·Filed 2002·Granted Jul 5, 2005·89 cites·32 claims
- 0297US7998335B2Controlled electrochemical polishing methodCABOT MICROELECTRONICS CORP·Filed 2005·Granted Aug 16, 2011·77 cites·28 claims
- 0397US7267607B2Transparent microporous materials for CMPCABOT MICROELECTRONICS CORP·Filed 2005·Granted Sep 11, 2007·37 cites·13 claims
- 0497US6776810B1Anionic abrasive particles treated with positively charged polyelectrolytes for CMPCABOT MICROELECTRONICS CORP·Filed 2002·Granted Aug 17, 2004·112 cites·34 claims
- 0597US6582623B1CMP composition containing silane modified abrasive particlesCABOT MICROELECTRONICS CORP·Filed 2000·Granted Jun 24, 2003·143 cites·21 claims
- 0696US9127187B1Mixed abrasive tungsten CMP compositionCABOT MICROELECTRONICS CORP·Filed 2014·Granted Sep 8, 2015·24 cites·26 claims
- 0796US7699684B2CMP porous pad with component-filled poresCABOT MICROELECTRONICS CORP·Filed 2007·Granted Apr 20, 2010·36 cites·11 claims
- 0896US6604987B1CMP compositions containing silver saltsCABOT MICROELECTRONICS CORP·Filed 2002·Granted Aug 12, 2003·45 cites·28 claims
- 0996US6217416B1Chemical mechanical polishing slurry useful for copper/tantalum substratesCABOT MICROELECTRONICS CORP·Filed 1998·Granted Apr 17, 2001·202 cites·11 claims
- 1095US9631122B1Tungsten-processing slurry with cationic surfactantCABOT MICROELECTRONICS CORP·Filed 2015·Granted Apr 25, 2017·19 cites·23 claims
- 1195US7311862B2Method for manufacturing microporous CMP materials having controlled pore sizeCABOT MICROELECTRONICS CORP·Filed 2005·Granted Dec 25, 2007·34 cites·10 claims
- 1295US6527622B1CMP method for noble metalsCABOT MICROELECTRONICS CORP·Filed 2002·Granted Mar 4, 2003·131 cites·34 claims
- 1394US7994057B2Polishing composition and method utilizing abrasive particles treated with an aminosilaneCABOT MICROELECTRONICS CORP·Filed 2008·Granted Aug 9, 2011·30 cites·19 claims
- 1494US7531105B2Polishing composition and method for high silicon nitride to silicon oxide removal rate ratiosCABOT MICROELECTRONICS CORP·Filed 2005·Granted May 12, 2009·28 cites·11 claims
- 1594US7435161B2Multi-layer polishing pad material for CMPCABOT MICROELECTRONICS CORP·Filed 2005·Granted Oct 14, 2008·31 cites·14 claims
- 1694US7265055B2CMP of copper/ruthenium substratesCABOT MICROELECTRONICS CORP·Filed 2005·Granted Sep 4, 2007·33 cites·19 claims
- 1794US6383065B1Catalytic reactive pad for metal CMPCABOT MICROELECTRONICS CORP·Filed 2001·Granted May 7, 2002·51 cites·40 claims
- 1893US9422456B2Colloidal silica chemical-mechanical polishing compositionCABOT MICROELECTRONICS CORP·Filed 2015·Granted Aug 23, 2016·9 cites·44 claims
- 1993US9303188B2Composition for tungsten CMPCABOT MICROELECTRONICS CORP·Filed 2014·Granted Apr 5, 2016·14 cites·20 claims
- 2093US7447298B2Decontamination and sterilization system using large area x-ray sourceCABOT MICROELECTRONICS CORP·Filed 2005·Granted Nov 4, 2008·17 cites·20 claims
- 2193US7071105B2Method of polishing a silicon-containing dielectricCABOT MICROELECTRONICS CORP·Filed 2003·Granted Jul 4, 2006·57 cites·28 claims
- 2293US6884156B2Multi-layer polishing pad material for CMPCABOT MICROELECTRONICS CORP·Filed 2003·Granted Apr 26, 2005·77 cites·38 claims
- 2393US6641630B1CMP compositions containing iodine and an iodine vapor-trapping agentCABOT MICROELECTRONICS CORP·Filed 2002·Granted Nov 4, 2003·45 cites·21 claims
- 2493US6461227B1Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing compositionCABOT MICROELECTRONICS CORP·Filed 2000·Granted Oct 8, 2002·52 cites·22 claims
- 2593US6126853AChemical mechanical polishing slurry useful for copper substratesCABOT MICROELECTRONICS CORP·Filed 1997·Granted Oct 3, 2000·116 cites·20 claims
- 2692US9505952B2Polishing composition containing ceria abrasiveCABOT MICROELECTRONICS CORP·Filed 2015·Granted Nov 29, 2016·14 cites·15 claims
- 2792US9499721B2Colloidal silica chemical-mechanical polishing compositionCABOT MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·8 cites·46 claims
- 2892US9422457B2Colloidal silica chemical-mechanical polishing concentrateCABOT MICROELECTRONICS CORP·Filed 2015·Granted Aug 23, 2016·7 cites·29 claims
- 2992US7585340B2Polishing composition containing polyether amineCABOT MICROELECTRONICS CORP·Filed 2006·Granted Sep 8, 2009·19 cites·7 claims
- 3092US7582127B2Polishing composition for a tungsten-containing substrateCABOT MICROELECTRONICS CORP·Filed 2007·Granted Sep 1, 2009·21 cites·13 claims
- 3192US6935931B2Microporous polishing padsCABOT MICROELECTRONICS CORP·Filed 2004·Granted Aug 30, 2005·44 cites·15 claims
- 3292US6936543B2CMP method utilizing amphiphilic nonionic surfactantsCABOT MICROELECTRONICS CORP·Filed 2002·Granted Aug 30, 2005·82 cites·30 claims
- 3392US6620037B2Chemical mechanical polishing slurry useful for copper substratesCABOT MICROELECTRONICS CORP·Filed 2002·Granted Sep 16, 2003·80 cites·28 claims
- 3492US6316366B1Method of polishing using multi-oxidizer slurryCABOT MICROELECTRONICS CORP·Filed 2000·Granted Nov 13, 2001·36 cites·7 claims
- 3592US6177026B1CMP slurry containing a solid catalystCABOT MICROELECTRONICS CORP·Filed 1998·Granted Jan 23, 2001·111 cites·21 claims
- 3691US6646348B1Silane containing polishing composition for CMPCABOT MICROELECTRONICS CORP·Filed 2000·Granted Nov 11, 2003·48 cites·26 claims
- 3791US6435947B2CMP polishing pad including a solid catalystCABOT MICROELECTRONICS CORP·Filed 2001·Granted Aug 20, 2002·55 cites·44 claims
- 3890US9567491B2Tungsten chemical-mechanical polishing compositionCABOT MICROELECTRONICS CORP·Filed 2015·Granted Feb 14, 2017·7 cites·41 claims
- 3990US9309442B2Composition for tungsten buffingCABOT MICROELECTRONICS CORP·Filed 2014·Granted Apr 12, 2016·6 cites·25 claims
- 4090US9238753B2CMP compositions selective for oxide and nitride with high removal rate and low defectivityCABOT MICROELECTRONICS CORP·Filed 2013·Granted Jan 19, 2016·12 cites·10 claims
- 4190US9238754B2Composition for tungsten CMPCABOT MICROELECTRONICS CORP·Filed 2014·Granted Jan 19, 2016·9 cites·17 claims
- 4290US6998166B2Polishing pad with oriented pore structureCABOT MICROELECTRONICS CORP·Filed 2003·Granted Feb 14, 2006·42 cites·16 claims
- 4390US6976905B1Method for polishing a memory or rigid disk with a phosphate ion-containing polishing systemCABOT MICROELECTRONICS CORP·Filed 2000·Granted Dec 20, 2005·34 cites·23 claims
- 4490US6852632B2Method of polishing a multi-layer substrateCABOT MICROELECTRONICS CORP·Filed 2003·Granted Feb 8, 2005·33 cites·34 claims
- 4590US6821897B2Method for copper CMP using polymeric complexing agentsCABOT MICROELECTRONICS CORP·Filed 2002·Granted Nov 23, 2004·60 cites·30 claims
- 4690US6447371B2Chemical mechanical polishing slurry useful for copper/tantalum substratesCABOT MICROELECTRONICS CORP·Filed 2001·Granted Sep 10, 2002·58 cites·25 claims
- 4789US9556363B2Copper barrier chemical-mechanical polishing compositionCABOT MICROELECTRONICS CORP·Filed 2015·Granted Jan 31, 2017·8 cites·36 claims
- 4889US8961807B2CMP compositions with low solids content and methods related theretoCABOT MICROELECTRONICS CORP·Filed 2013·Granted Feb 24, 2015·5 cites·21 claims
- 4989US7316603B2Compositions and methods for tantalum CMPCABOT MICROELECTRONICS CORP·Filed 2005·Granted Jan 8, 2008·16 cites·39 claims
- 5089US6431953B1CMP process involving frequency analysis-based monitoringCABOT MICROELECTRONICS CORP·Filed 2001·Granted Aug 13, 2002·57 cites·23 claims
Showing the top 50 of 334 patent records by PatentIndex Score.
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