Assignee
CATLAM LLC
US11 patents
Top patents by PatentIndex Score
US11638354B2Apr 25, 2023
Process for fabrication of a printed circuit board using a semi-additive process and removable backing foil
CATLAM LLC2 citations72
US12513827B2Dec 30, 2025
Semi-additive process for catalytic printed circuit boards
CATLAM LLC0 citations62
US11653453B2May 16, 2023
Electroless and electrolytic deposition process for forming traces on a catalytic laminate
CATLAM LLC0 citations62
US11477893B2Oct 18, 2022
Catalytic laminate with conductive traces formed during lamination
CATLAM LLC0 citations62
US10959329B2Mar 23, 2021
Circuit board using non-catalytic laminate with catalytic adhesive overlay
CATLAM LLC0 citations62
US11406024B2Aug 2, 2022
Multi-layer circuit board with traces thicker than a circuit board
CATLAM LLC0 citations61
US11039540B2Jun 15, 2021
Multi-layer circuit board with traces thicker than a circuit board layer
CATLAM LLC0 citations61
US10806029B2Oct 13, 2020
Catalytic circuit board with traces and vias
CATLAM LLC0 citations51
US10765003B2Sep 1, 2020
Method for making a multi-layer circuit board using conductive paste with interposer layer
CATLAM LLC0 citations51
US10685931B2Jun 16, 2020
Method and apparatus for forming contacts on an integrated circuit die using a catalytic adhesive
CATLAM LLC0 citations51
US10573610B2Feb 25, 2020
Method for wafer level packaging
CATLAM LLC0 citations41