Assignee

CERIDAN CORP

US·1 granted patent·19 citations·filing 1996–1996

Technology mixB23K1 H05K1 H10W1

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0148US5746367AMethod and apparatus to wick solder from conductive surfacesCERIDAN CORP·Filed 1996·Granted May 5, 1998·19 cites·10 claims

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