Assignee
CHAKRAPANI NIRUPAMA
0 granted patents·4 pending applications·0 citations·filing 2005–2010
Top patents by PatentIndex Score
4 records- 0149US2007135550A1Negative thermal expansion material filler for low CTE compositesCHAKRAPANI NIRUPAMA·Filed 2005·Application pending·0 cites
- 0248US2011003402A1Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectricsCHAKRAPANI NIRUPAMA·Filed 2010·Application pending·0 cites
- 0346US2008067502A1Electronic packages with fine particle wetting and non-wetting zonesCHAKRAPANI NIRUPAMA·Filed 2006·Application pending·0 cites
- 0440US2008026505A1Electronic packages with roughened wetting and non-wetting zonesCHAKRAPANI NIRUPAMA·Filed 2006·Application pending·0 cites
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