Assignee
CHANDRA HARRY
US4 patents
Top patents by PatentIndex Score
US8598690B2Dec 3, 2013
Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground
CHANDRA HARRY20 citations90
US8110441B2Feb 7, 2012
Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die
CHANDRA HARRY37 citations90
US8723302B2May 13, 2014
Integrated circuit package system with input/output expansion
CHANDRA HARRY14 citations82
US8653654B2Feb 18, 2014
Integrated circuit packaging system with a stackable package and method of manufacture thereof
CHANDRA HARRY12 citations81