Assignee
CHANG CHIH-HORNG
TW·4 granted patents·26 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0194US8853853B2Bump structuresCHANG CHIH-HORNG·Filed 2011·Granted Oct 7, 2014·24 cites·20 claims
- 0267US9257385B2Landing areas of bonding structuresCHANG CHIH-HORNG·Filed 2011·Granted Feb 9, 2016·2 cites·19 claims
- 0352US8710681B2Isolation rings for blocking the interface between package components and the respective molding compoundCHANG CHIH-HORNG·Filed 2012·Granted Apr 29, 2014·0 cites·20 claims
- 0439US8308052B2Thermal gradient reflow for forming columnar grain structures for solder bumpsCHANG CHIH-HORNG·Filed 2010·Granted Nov 13, 2012·0 cites·10 claims
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