Assignee
CHANG HONG-DA
TW·2 granted patents·2 pending applications·10 citations·filing 2007–2012
Top patents by PatentIndex Score
4 records- 0185US9133021B2Wafer level package having a pressure sensor and fabrication method thereofCHANG HONG-DA·Filed 2011·Granted Sep 15, 2015·9 cites·8 claims
- 0265US8525324B2Semiconductor package and method of fabricating the sameCHANG HONG-DA·Filed 2012·Granted Sep 3, 2013·1 cites·18 claims
- 0338US2008096137A1Method for fabricating flow channel capable of balancing air pressureCHANG HONG-DA·Filed 2007·Application pending·0 cites
- 0433US2013320463A1Package structure having mems element and fabrication method thereofCHANG HONG-DA·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →