Assignee
CHAUN CHOUNG TECH CORP
TW·7 granted patents·7 pending applications·14 citations·filing 2014–2019
Top patents by PatentIndex Score
14 records- 0181US9578780B1Heat dissipating deviceCHAUN-CHOUNG TECH CORP·Filed 2015·Granted Feb 21, 2017·10 cites·8 claims
- 0271US10154613B1Electronic device and heat dissipation structure thereofCHAUN CHOUNG TECH CORP·Filed 2018·Granted Dec 11, 2018·3 cites·8 claims
- 0362US9481056B2Method of making lightweight heat pipeCHAUN-CHOUNG TECH CORP·Filed 2014·Granted Nov 1, 2016·1 cites·5 claims
- 0460US9488418B2Heat plate structureCHAUN-CHOUNG TECH CORP·Filed 2014·Granted Nov 8, 2016·0 cites·6 claims
- 0545US2019301813A1Sleeve-type heat conducting structureCHAUN CHOUNG TECH CORP·Filed 2019·Application pending·0 cites
- 0643US10612863B2Pressing method of heat conductive base and finished product thereofCHAUN CHOUNG TECH CORP·Filed 2018·Granted Apr 7, 2020·0 cites·6 claims
- 0737US2017010048A1Thin vapor chamber and manufacturing method thereofCHAUN-CHOUNG TECH CORP·Filed 2015·Application pending·0 cites
- 0837US2017241430A1Combined fan and cooling device using the sameCHAUN-CHOUNG TECH CORP·Filed 2016·Application pending·0 cites
- 0935US9726436B2Vapor chamber having no gas discharging protrusion and manufacturing method thereofCHAUN-CHOUNG TECH CORP·Filed 2015·Granted Aug 8, 2017·0 cites·15 claims
- 1033US2018031329A1Heat dissipating deviceCHAUN-CHOUNG TECH CORP·Filed 2016·Application pending·0 cites
- 1130US2017108285A1Lateral surrounding heat pipe and heat dissipating structure thereofCHAUN-CHOUNG TECH CORP·Filed 2015·Application pending·0 cites
- 1229US9689623B2Composite structure of flat heat pipe and heat conduction device thereofCHAUN-CHOUNG TECH CORP·Filed 2015·Granted Jun 27, 2017·0 cites·10 claims
- 1323US2017082378A1Vapor chamber structureCHAUN-CHOUNG TECH CORP·Filed 2015·Application pending·0 cites
- 1423US2017038154A1Vapor chamber structure having stretchable heated partCHAUN-CHOUNG TECH CORP·Filed 2015·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →