Assignee
CHEN HSIN-YU
6 granted patents·12 pending applications·31 citations·filing 2006–2012
Top patents by PatentIndex Score
18 records- 0183US9006101B2Interconnect structure and methodCHEN HSIN-YU·Filed 2012·Granted Apr 14, 2015·6 cites·19 claims
- 0280US8146765B2Sealing cover for containersCHEN HSIN-YU·Filed 2007·Granted Apr 3, 2012·9 cites·5 claims
- 0368US8900996B2Through silicon via structure and method of fabricating the sameCHEN HSIN-YU·Filed 2012·Granted Dec 2, 2014·2 cites·10 claims
- 0463US8503819B2Method and circuit for correcting defect pixels in image signalCHEN HSIN-YU·Filed 2008·Granted Aug 6, 2013·3 cites·14 claims
- 0560USD641184SShelf for stereoCHEN HSIN-YU·Filed 2011·Granted Jul 12, 2011·11 cites·1 claims
- 0656US2008217335A1Vacuum seal cover of circular containerCHEN HSIN-YU·Filed 2007·Application pending·0 cites
- 0755US2008110911A1Fastening structure and seal box with the fastening structureCHEN HSIN-YU·Filed 2006·Application pending·0 cites
- 0854US2007265587A1Vacuum container and method of using thereofCHEN HSIN-YU·Filed 2006·Application pending·0 cites
- 0950US2010251453A1Garment with Light Signal Indicating SystemCHEN HSIN YU·Filed 2008·Application pending·0 cites
- 1047US2012161044A1Vacuum valveCHEN HSIN-YU·Filed 2010·Application pending·0 cites
- 1144US8691688B2Method of manufacturing semiconductor structureCHEN HSIN-YU·Filed 2012·Granted Apr 8, 2014·0 cites·17 claims
- 1243US2013324191A1External electronic device and method for wirelessly accessing storage deviceCHEN HSIN-YU·Filed 2012·Application pending·0 cites
- 1342US2013076986A1Batteryless digital television receiverCHEN HSIN-YU·Filed 2011·Application pending·0 cites
- 1440US2013299993A1Interconnection of semiconductor device and fabrication method thereofCHEN HSIN-YU·Filed 2012·Application pending·0 cites
- 1539US2013270712A1Through silicon via structure and method of fabricating the sameCHEN HSIN-YU·Filed 2012·Application pending·0 cites
- 1639US2011266117A1Locking device on the motor switchCHEN HSIN-YU·Filed 2011·Application pending·0 cites
- 1738US2013037953A1Through silicon via structure and manufacturing method thereofCHEN HSIN-YU·Filed 2011·Application pending·0 cites
- 1838US2013256843A1Wafer sawing method and wafer structure beneficial for performing the sameCHEN HSIN-YU·Filed 2012·Application pending·0 cites
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