Assignee
CHEN MING-FA
TW12 patents
Top patents by PatentIndex Score
US8803292B2Aug 12, 2014
Through-substrate vias and methods for forming the same
CHEN MING-FA383 citations98
US8158456B2Apr 17, 2012
Method of forming stacked dies
CHEN MING-FA127 citations95
US8791549B2Jul 29, 2014
Wafer backside interconnect structure connected to TSVs
CHEN MING-FA29 citations93
US8399354B2Mar 19, 2013
Through-silicon via with low-K dielectric liner
CHEN MING-FA18 citations93
US8624324B1Jan 7, 2014
Connecting through vias to devices
CHEN MING-FA16 citations92
US8501587B2Aug 6, 2013
Stacked integrated chips and methods of fabrication thereof
CHEN MING-FA32 citations92
US8518796B2Aug 27, 2013
Semiconductor die connection system and method
CHEN MING-FA6 citations84
US8288872B2Oct 16, 2012
Through silicon via layout
CHEN MING-FA8 citations84
US8222139B2Jul 17, 2012
Chemical mechanical polishing (CMP) processing of through-silicon via (TSV) and contact plug simultaneously
CHEN MING-FA9 citations82
US8643149B2Feb 4, 2014
Stress barrier structures for semiconductor chips
CHEN MING-FA6 citations73
US8436448B2May 7, 2013
Through-silicon via with air gap
CHEN MING-FA3 citations63
US8546886B2Oct 1, 2013
Controlling the device performance by forming a stressed backside dielectric layer
CHEN MING-FA2 citations60